Analysis: Can China even build data center AI chips?

SMIC runs Kirin 9030 on its N+3 node using DUV, proving scaled mobile logic, but limits make it unsuitable for large data center AI chips.

In our recent teardown analysis, we found that SMIC has successfully implemented Kirin 9030 mobile processor using SMIC’s N+3 node. This demonstrates that China can produce scaled logic silicon using DUV lithography. Even though China is able to manufacture a production quality smartphone chip using N+3 node, we believe that it will not be a viable solution for data center AI chips. Limitations of the DUV, combined with newness of the process will lead to low yields for data center AI chips that are much larger in size compared to smartphone chips. China might nevertheless continue to develop the process to bring out the national pride, despite it not being a commercial success.