Infineon EDT3 Automotive IGBT from FS1150R08A8P3LMC 750 V HybridPACK Drive G2 Module

Infineon EDT3 Automotive IGBT from FS1150R08A8P3LMC 750 V HybridPACK Drive G2 Module

Dive into the analysis of Infineon's EDT3 IGBT components and packaging, an essential and cost-productive power module for electric vehicle traction inverters.

Infineon’s HybridPACK Drive G2 is a product family of power modules for electric vehicle (EV) traction inverters. It builds on the HybridPACK Drive G1’s six-pack package and comes with 750 V and 1200 V options using either the new EDT 3 silicon (Si) insulated-gate bipolar transistor (IGBT) or CoolSiC G2 silicon carbide (SiC) MOSFETs.

Even as SiC MOSFETs are becoming increasingly adopted for EV traction inverters, IGBTs is still a cost-productive alternative for this application. Infineon’s EDT3 IGBT is the successor for the EDT2 IGBT, providing a 15-25% increase in power density by reducing the saturation voltage (V[CE,sat]), faster switching with an improved diode, self-controlled turn-off, and an extended junction temperature rating of 185°C. The EDT3 IGBT dies examined in this analysis are found in Infineon’s FS1150R08A8P3LMC 750 V, 1150 A HybridPACK Drive G2 module.

View the Analysis

This summary outlines the analysis found on the TechInsights' Platform.

Enter your email to register to the TechInsights Platform and access the full analysis summary, as well as the report.
 

Already a TechInsights Platform User?

View the Analysis

Memory Market Developments in 2025 and Beyond

2025 Semiconductor Year in Preview

Register today and don’t miss out—reserve your seat today for exclusive insights that will give you a competitive edge in 2025 and beyond!

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.