Explore Qualcomm die HG11-62969-200 from the Xiaomi 15 Pro. Dive into floorplan analysis, key features, process tech, and critical dimensions.
This report presents a Basic Floorplan Analysis of the Qualcomm die HG11-62969-200 found inside the Qualcomm WCN7861-101-00 component. The Qualcomm WCN7861-101-00 component was extracted from the Xiaomi 15 Pro smartphone.
TechInsights Experts Analyze the Impact on Supply Chains, Costs, and Market Winners in a Rapidly Shifting Semiconductor Landscape.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
