Using TechInsights Chiplet and Advanced Packaging Analysis to Navigate an Evolving Landscape

The Challenge

The customer has sought the expertise of TechInsights to address their need for comprehensive market insights, technology roadmaps, and the competitive dynamics that factor into their product development strategies.

To establish strategic market positioning and roadmap development, the customer needs to understand global trends, as well as which market segments to target and when. Accordingly, the customer is searching for more information on current commercialized technologies and end markets. Critical insights into how Chiplet designs, and Advanced Packaging solutions relate to their product development strategies and impact technological evolution are a top priority. Easy access to an extensive library of Advanced Packaging and Chiplet data would significantly enhance the customer’s ability to identify gaps and make informed decisions regarding product development.

When weighing the pros and cons of adopting new technology versus building upon existing platforms, the customer needs to balance future innovations with cost and performance expectations. Decision-makers must guarantee effective early-stage leadership while avoiding a total revamp of existing platforms to ensure time-to-market goals are achieved. To assist with developing their vision and identifying opportunities for growth, the customer is dependent on insights into competitor roadmaps and the latest innovations in Chiplet and Advanced Packaging technology.

How TechInsights Can Help

To address these challenges, the customer has leveraged the support of TechInsights to fulfill their advanced packaging and chiplet needs. TechInsights’ reverse engineering coverage provides strategic insights, technical validation and competitive intelligence to provide clarity in a complex and evolving market.

To enhance strategic positioning and roadmap development, TechInsights can provide the customer with inputs to technological pathfinding that paints a clear picture of how global trends in advanced packaging and chiplet technology are evolving. With our content, the customer can identify the market segments that are most suitable for early adoption of chiplet design and advanced packaging strategies. This content can also be a valuable resource for market intelligence, which should help the customer fill gaps in market reporting, competitive intelligence and technical analysis.

Another key initiative for the customer will be balancing innovation with cost and performance, which TechInsights addresses with cost-performance analyses and future technology projections. TechInsights’ expertise in this area can support decision-making processes that ensure innovations are approached with a cost-saving and performance enhancement focus. These cost savings can be used to invest in TechInsights’ market and intelligence reports, which provide unparallelled access to data on emerging solutions and regional players such as start-ups, Chinese manufacturers and other formidable entities to help the customer anticipate market shifts.

Results/Potential Outcomes

The IDM can compete and win against top players in the advanced packaging and chiplet market with the resources provided to them by TechInsights. The customer can now leverage comprehensive strategic insights to improve product development processes, reference technology roadmaps to enhance market positioning and acquire competitive intelligence to identify emerging competitors. Derisking strategic technology choices, expediting product development timelines and securing advantages over the field have the power to lead the customer to advanced packaging and chiplet market dominance.