Fabless Semiconductor

Advanced Packaging

Advanced Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Packaging

Semiconductor Manufacturing Drivers

Semiconductor Manufacturing Drivers provide critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

Chiplet

Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Market Data
• Supply Analysis
• Product Features

Device Essentials

Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Packaging
• Process

Power Essentials

Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

RFIC Packaging

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

• Block Diagram
• High Resolution Images
• Packaging

SoC Markets

SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis
• Product Features

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

ADAS Controller Teardown

ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

ADAS Design Material and Assembly Teardown

ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:

• Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions
• Images of subassemblies and their major components
• Weights and dimensional attributes of key components
• Weights and dimensional attributes of key components
• Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*
• Surface treatments*
• Thermal solutions
• Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
• IC selection

* = Where identifiable

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Audio Amplifier Teardown

Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Automotive IC Win Database

The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.

• Block Diagram
• Cost Analysis
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• High Resolution Images
• Product Features

Automotive Semiconductors

The Automotive coverage area integrates analytics from both the demand perspective of the automotive sector and the supply dynamics of semiconductors. The demand forecast tracks the dominant automotive semiconductor components such as processors, power, memory, DSPs, ASICs, image sensors, optoelectronics, among others. Additionally, the analysis provides a examination of market shares and financial profiles for top-tier automotive semiconductor firms, as well as the production capabilities of the foremost Integrated Device Manufacturers (IDMs).

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Autonomous Vehicles

Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Camera Teardown

Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Electric Vehicles

Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Infotainment Teardown

Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Infotainment and Telematics

Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

LiDAR Design Material and Assembly Teardown

LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

LiDAR Teardown

LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Powertrain, Body, Chassis and Safety

Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Notebooks and Tablets Teardown

Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

SSD Teardown

SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Data Center / Cloud Semiconductors

The Data Center / Cloud coverage area offers an integrated perspective on the essential components of global data centers for the upcoming five years, encompassing memory, storage solutions, CPUs, AI/GPU accelerators, and server infrastructure. This comprehensive analysis spans both private data centers and public cloud environments. It features a comparative evaluation of top public cloud providers, projecting service hours and hardware requisites. Additionally, the report includes an assessment of hardware market shares, highlighting dominant manufacturers in server, CPU, and accelerators.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Personal Computing Semiconductors

Coming Soon!

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Connected Computing Devices

Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Connected Home Devices

Connected Home Devices gives you instant access to our extensive supply-side research and analysis of the latest trends impacting the global consumer electronics market. Served through the TechInsights Platform, you can view our current and historical forecasts and market trackers, read our expert commentary, and understand the competitive landscape across a range of product categories including Flat Panel TVs, Game Consoles, Wireless Speakers, Soundbars, Set-Top Boxes, Streaming Media Players and eBook readers.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Connected TV Strategies

Connected TV Strategies is designed to help players across the CTV ecosystem from device vendors to content owners and service providers navigate the transition from legacy TV to streaming TV. CTVS combines detailed quarterly vendor and OS share tracking of connected TV devices with deep insights into the key trends shaping the market and the implications for content owners. CTVS offers customers an objective, research-driven approach to addressing the central strategic questions facing the CTV hardware, media and entertainment industries today.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Gaming Teardown

Gaming Teardown is the world's largest teardown library, housing an impressive collection of devices analyzed per year. Our industry-agnostic approach provides unbiased analysis to empower fact-based decision-making. Delve into the design philosophies and discover the design wins behind these innovative creations. With over 30+ teardowns conducted annually, our expertise has been relied upon by leading OEMs, semiconductor manufacturers, and component companies for more than 25 years. 

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

IoT Teardowns

With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Smart Home Strategies

Smart Home Strategies tracks devices and focuses on emerging opportunities in home monitoring, energy management, and home control systems and services. After many years of market exploration and trials, digital and IP technologies are finally enabling widespread commercial service deployments which allow consumers to control and interact with their home security, energy and management systems. Smart Home Strategies builds on TechInsights’ 40-year heritage in exploring emerging home technology, application and service opportunities and identifies the key factors for success in this next stage in the digital home’s evolution.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Smart Home Teardown

Smart Home Teardown provides analyses on an assortment of products ranging from operator deployed Set-Top-Boxes and OEM media streaming devices to smart speakers, Wi-Fi routers, and surveillance cameras. Get insights on costing trends and design techniques across the smart home ecosystem. Sample manufacturers include: Amazon, Google, Roku, Apple, Samsung, Sony.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Consumer Electronics Semiconductors

Coming Soon!

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

SSD Teardown

SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Chip Insider

The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner. 

• Inquiry Privileges
• Insight Reports

McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

• Inquiry Privileges
• Insight Reports

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

Semiconductor Analytics

Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Semiconductor Industry Performance

Semiconductor Industry Performance content provides a unique view into the health of the semiconductor manufacturing ecosystem, including key performance indicators across electronics, semiconductor, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

Circuit Analysis

Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Device Essentials

Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Packaging
• Process

Device Essentials Plus

Device Essentials Plus (DEP) is an extension of SEM-based Device Essentials (DEF), performed on a subset of the annual DEF targets. DEP offers thorough structural and dopant analyses using TEM, TEM-EDS, TEM-EELS, SCM/sMIM, and SIMS analytical techniques.

• Component Price and Lead-time Trends
• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Process

Image Signal Processor

Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

• Competitor Analysis
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• IC Floorplan

Process Flow Analysis

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• High Resolution Images
• Market Data
• Process Flow Analysis

Sensors Semiconductors

The Sensors coverage area offers insights into the market share and future trends of smartphone fingerprint and image sensors. It tracks the shipments of image sensors by model, complete with detailed sensor specifications. This coverage also provides a forward-looking five-year forecast, breaking down unit shipments, revenues, and Average Selling Price (ASP) across both Imaging and 3D Sensing CMOS Image Sensor (CIS) segments. Fingerprint sensor coverage, includes shipments, revenue, and ASP and is further categorized by vendor and technology, offering a granular view of the market landscape.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Transceiver Floorplan

IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Transceiver Architecture

IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

RF/Analog Semiconductors

The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.

Telecom Strategies

Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

AI Processor Service

AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Product Features

AI Semiconductors

The AI coverage area focuses on the AI technology and how it impacts semiconductor market. The forcasts include market size for various domains, including Data Centers, Cloud, PCs, Automotive, and mobile devices. It covers a range of hardware components, such as CPUs, GPUs, ASICs, and FPGAs. Additionally, the coverage offers both qualitative and quantitative insights into the latest trends in the AI market such as generative AI, LLMs, neural network evolution and so on.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Advanced CMOS Essentials

Advanced CMOS Essentials focuses on leading-edge SoCs and the technology used to manufacture them through structural and materials analysis. It identifies differences or nuances between competing technologies and differences between process technology options from the same company. Process Analytics offers aggregated process data, helping you create visualizations and trends of company, product, and technology evolution.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Process

Compute Semiconductors

The compute coverage area delivers market share data and forecast analysis, encompassing cloud infrastructure, client computing, and embedded computing. The cloud computing segment includes microprocessors, accelerators, FPGAs and captive market ASICs. The client computing segment comprises CPUs, APUs, ASICs, and GPUs. The embedded computing segment includes MPUs, MCUs, FPGAs, DSPs, and GPUs. All these categories provide comprehensive coverage of AI processors and accelerators within their respective segments.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Data Center / Cloud Semiconductors

The Data Center / Cloud coverage area offers an integrated perspective on the essential components of global data centers for the upcoming five years, encompassing memory, storage solutions, CPUs, AI/GPU accelerators, and server infrastructure. This comprehensive analysis spans both private data centers and public cloud environments. It features a comparative evaluation of top public cloud providers, projecting service hours and hardware requisites. Additionally, the report includes an assessment of hardware market shares, highlighting dominant manufacturers in server, CPU, and accelerators.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Digital Floorplan

Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

• Competitor Analysis
• Data Visualisation
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• High Resolution Images
• Packaging
• Performance Analysis
• Process
• Product Features

Process Flow Analysis

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

SoC Design Analysis

Soc Design provides analysis of 4 sites in CPU, NPU, or GPU cores on high-volume, cutting-edge SoCs, addressing engineers’ challenges in gaining accurate benchmarking data on gate density, routing efficiency, and utilization. This expanded analysis also provides high-resolution imaging of SRAM and transition regions and can reveal critical redundancy strategies such as NVM rerouting, which help improve fault tolerance with repairable patterns. Engineers struggling to differentiate their designs can benefit from high-resolution images of custom cells and architectural choices like flying bitline design. Served through TechInsights’ CircuitVision and Analytics visualization tools, engineers are empowered to visualize and compare data across products and technologies, making it easier to identify the right optimization opportunities and enhance design efficiency. This solution reduces the time and complexity of competitive benchmarking while driving informed, fact-based design decisions.

• Circuit
• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports

SoC Markets

SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis
• Product Features

Transistor Architecture Comparison

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Transistor Comparison

Transistor Characterization

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Performance Analysis

CMRS Equipment Database

CMRS Equipment Database covers market shares with annual and quarterly forecasts for these segments along with equipment demand by device type and region.

• Market Data
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges

Semiconductor Manufacturing Drivers

Semiconductor Manufacturing Drivers provide critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

CMRS More than Moore

CMRS More than Moore analysis focuses on equipment markets for greater than 28nm semiconductor manufacturing. Typical segments include LED, MEMs, power, and compound semiconductors.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

CSUBs Critical Components

CSUBs Critical Components includes market shares and forecast data for critical components as well as additional analysis for applications, consumption by equipment type or by OEMs and fabs​.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

CSUBs Supplier Share

Market share and forecast data for critical subsystem and components as well as equipment and chamber unit demand,

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Supply Analysis
• Inquiry Privileges
• Market Data

CSUBs Driving Forces

Essential data for assessing current market status, forecasting, and building dashboards.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Supply Analysis
• Inquiry Privileges
• Market Data

TST Device Interface Board Report

TST Device Interface Board Report provides market sizing and share databases, forecasts, regional and application sales​ for DIB providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data

TST Probe Card Report

TST Probe Card Report provides market sizing and share databases, forecasts, and regional and application sales​ for providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data

TST Test Burn-In Socket Report

TST Burn-In Socket Report provides market sizing and share databases, forecasts, regional and application sales​ for providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data

Process

Advanced Memory Process analysis provides an overview of chip technology, critical features, and dimensions. It provides analyst insights into technical trends and roadmaps, design technology interaction analyses, detailed explanations of process integrations, and next node predictions.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process

DRAM Circuit Analysis

Highlights circuit innovation by providing full, transistor-level analysis on leading-edge DRAM memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

DRAM Floorplan

In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. DRAM Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports

DRAM Peripheral Design

NAND Peripheral Design focuses on the circuit schematic design of critical NAND device metrics for a better understanding of peripheral design, functionality, structure, and layout to help accelerate R&D and fast-track the design learning curve.

• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

DRAM SWD and SA Transistor Characterization

Provides cross-technology and trend analysis as well as information on the performance of transistors used in DRAM through transistor characteristic analysis. Professionals from foundries, IDMs, and fabless organizations use this analysis to benchmark against competitors and to see how process differences impact performance between technologies.

• Block Diagram
• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Transistor Comparison

Embedded and Emerging Functional and Process Analysis

Embedded and Emerging Functional and Process Analysis is focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. It also provides analyst perspectives on the above to provide insight into trends and roadmaps. Analysis may include SEM cross-sectional and bevel imaging, TEM cross-sectional with TEM EDS, technical trend/roadmap by technology element, interaction analysis, detailed explanation of process integrations and/or next node predictions.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Process

Embedded and Emerging Process Flow

Embedded and Emerging Process Flow provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips to help identify areas for process optimization.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

Memory Semiconductors

The Memory coverage area provides a comprehensive analysis of the NAND and DRAM markets, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive (DRAM) and SSDs, eMMC and UFS (NAND). It meticulously maps the market landscape, offering insights into production volumes, pricing trends, technological advancements, and market shares. The report highlights the factors influencing memory supply, such as manufacturing capacities and capacity utilization, and delves into demand fluctuations driven by consumer electronics cycles, enterprise IT investments, AI and automotive industry requirements.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

NAND Circuit Analysis

Highlights circuit innovation by providing full, transistor-level analysis on leading-edge NAND memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

NAND Internal Waveform Analysis

NAND Internal Waveform Analysis captures the specific steps, pulses, and amplitudes on select pins during program, read, and erase cycles of one flash die of a package. The content provides an innovative, cost-effective approach to delivering a subset of a waveform analysis report.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Systems

NAND Floorplan

In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports

NAND Transistor Characterization

NAND Transistor Characterization provides cross-technology analysis and information on the performance of transistors used in NAND devices through transistor characteristic analysis. It provides key information on competition and vendor performance with unbiased third party data.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Transistor Comparison

Process Flow Analysis

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

SSD Teardown

SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Acoustic Wave Filter

Refine your product roadmap, align with industry trends, and outpace competitors, ensuring your success in the challenging 5G Mobile RF landscape.

• Block Diagram
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process

Front End Die Circuit

Reveals how leading manufacturers are addressing space and power challenges in RF power amplifiers (PAs), low noise amplifiers (LNAs) and RF switches found on current RF Front End Modules. Extends the analysis from the Front End Module Architecture content to reveal more detailed insight at the circuit level.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Product Features

Front End Module Architecture

Provides more insight on how leading manufacturers are shifting away from discrete components to more space efficient solutions like power amplifier modules (PAM) and transceiver antenna modules. Shows interconnectivity of the die, filters and components from highly integrated RF Front End Modules (FEMs) found on cutting-edge designs from the latest 5G handsets.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

Front End Power Management Architecture

Enables a better comparison and understanding of how design constraints for power supply management are addressed. Includes and builds on the Front End Power Management Floorplan content to provide detailed block level architecture of envelope/average power trackers and FR2 PMICs.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Front End Power Management Floorplan

Focuses on power supply management, which is a key design challenge for RF Front End systems within market leading 5G handsets. Provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for envelope/average power trackers and FR2 PMICs from recent 5G smartphone platforms and wearables.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

IoT Teardowns

With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Mobile RF Architecture

Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design. There is no black boxing, and the reports include all passives in the system, antenna tuners, filters, FEM high-level layout, pin ins/pin outs, circuit board delayering, and cross-probing between the schematic and the layout of the physical printed circuit board (PCB).

• Block Diagram
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Mobile Semiconductors

The Mobile coverage area provides a comprehensive analysis of semiconductor consumption by leading mobile device manufacturers. It integrates this data with market share insights from key players in the application processor and baseband semiconductor landscape. The analysis is further enriched with detailed coverage of RF components, AI-capable application processors, as well as Apple’s A-series and M-series chips, tablet / mobile PC application processors and mobile memory.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Mobile Teardowns

Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

RFIC Packaging

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

• Block Diagram
• High Resolution Images
• Packaging

RFIC Process

RFIC Process provides structural and materials analysis of transceivers and front end modules from the latest 5G handsets to reveal die structures and materials used during the manufacturing process. It includes topographical imaging and SEM/TEM cross-sectional with EDS/EELS materials analysis of the die structure.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Transceiver Architecture

Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Transceiver Basic Floorplan

Transceiver Basic Floorplan targets the most innovative IoT SoC devices to provide key information on die utilization, block sizes and functionality, die cost and more, to better understand the core functions of the SoC chip.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Wearables Teardown

Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

RF/Analog Semiconductors

The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

PMIC Process Analysis

PMIC Process Analysis provides in-depth process (structural and materials) analysis of power-management devices based on bipolar-CMOS-DMOS (BCD) technology, integrated voltage regulators (IVR), and other innovative power management devices. It includes analysis of PMICs found in devices in mobile, automotive, and other industries, and covers structures and materials using SEM, TEM, sMIM/SCM, SEM-EDS, and TEM-EDS/EELS as required. It also includes package and die images and salient features with a comparison summary.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Power Essentials

Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Power Semiconductors

The Power coverage area includes the market share of leading vendors, along with market forecasts segmented by technology (GaN, Si, SiC), device type, end-market application, and region. The device types considered in this coverage include power ICs, power discretes, and power modules.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data
• Supply Analysis

Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow

Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.

• Block Diagram
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Process Flow

Connected Computing Devices

Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Emerging Device Technologies

Emerging Device Technologies delivers fast-moving shipment tracking and sales forecasting of the key technologies powering modern smartphones and emerging classes of new devices. EDT identifies the key technologies powering smartphones right now and which will emerge in the future, such as artificial intelligence or 5G mmWave. Technology is the lens used to track device shipments and sales for individual vendors across the globe down to the country level.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Mobile Semiconductors

The Mobile coverage area provides a comprehensive analysis of semiconductor consumption by leading mobile device manufacturers. It integrates this data with market share insights from key players in the application processor and baseband semiconductor landscape. The analysis is further enriched with detailed coverage of RF components, AI-capable application processors, as well as Apple’s A-series and M-series chips, tablet / mobile PC application processors and mobile memory.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Mobile Teardowns

Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Notebooks and Tablets Teardown

Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

PriceTRAX

PriceTRAX Web for smartphones, tablets, feature phones, and wearables tracks competitor pricing strategies, country-specific and regional dynamics, price erosion, and more. View the retail value between variants of the same model to determine technology pricing trends and see current competitor retail prices with a full history dating back to 2010. Designed for responsiveness, PriceTRAX Smartphone dashboards include bundle pricing analytics, device-only prices, and spec/price analytics.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Market Data

Smartphone Country Share Tracker

Smartphone Country Share Tracker gives you timely, super-detailed tracking of smartphone brand shipments and market share by country, operator, and global best-selling models.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Market Data

SpecTRAX

SpecTRAX tracks new model announcements and complete hardware specification profiles for over 50,000 smartphones, tablets, feature phones, and wearables. It breaks down products into more than 350 standardized attributes for data that is exportable and ready to analyze. You’ll also get access to product availability from mobile operators and retailers, tracked across over 50 countries.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Supply Analysis

Telecom Strategies

Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Wearable Device Ecosystem

Wearable Device Ecosystem gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. It also delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share, and price.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Wearables Teardown

Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Wireless Smartphone Strategies

Wireless Smartphone Strategies provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier, and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarters and country-level smartphone forecast data for the next 5 years are provided.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis