Latest Blogs and Commentary
OECD Fixed Voice and Leased Line Price Benchmarking Q1 2024
The Q1 2024 OECD Fixed Voice and Leased Line Price Benchmarking Service update is now available for download. The services incorporate the OECD 2017 baskets, the latest baskets available for fixed voice and leased lines.
Analysis: Tablet Forecast Update Q4 2023 – Tablet Growth to Return in Post-COVID Refresh Cycle
The last half of 2023 showed tablet demand begin to stabilize as inflation cooled, the economy improved in many markets, and tablets purchased during the pandemic began hitting the mid-point of their lifecycles.
Global Wearables Shipment Forecast by Type by Vendor by Quarter: 2017 to 2024
Global wearable shipments are forecasted to grow by 4% in 2024, after declining by just 1% in 2023 and before that declining by 6% in 2022. Apple, Huawei, and Samsung will remain the market leaders in the global total wearables market.
Samsung S5540 FR1 RF Transceiver Floorplan Analysis
The Samsung S5M5540 die analyzed in this basic floorplan report (BFR) was found inside the Samsung S5540 component. The S5540 component, an RF transceiver, was extracted from the Samsung Galaxy S24+ smartphone.
Samsung S5820 Envelope Tracker Floorplan Analysis
The Samsung S5M5820A01 die analyzed in this basic floorplan analysis (BFR) report was found inside the Samsung S5820 component. The S5820 component was extracted from the Samsung Galaxy S24+ smartphone.
Can OliverIQ Transform the Smart Home market?
OliverIQ was unveiled at the Consumer Electronics Show (CES) 2024 as a Smart Home-as-a-Service (ShaaS) for a variety of service providers, including ISPs, home center retailers, and home builders to offer to their customers.
TSMC Dominates While NVIDIA's Growth Triples in 2023 Top 25 Semiconductor Supplier Rankings
The list of top-25 semiconductor suppliers is provided in this bulletin. Stay tuned as we delve deeper into the dynamics of these industry giants and what their positions might spell for the global market.
Micron Technology MT29F2T08ELLLHL4-QA_L 232L 512Gb TLC 3D NAND Flash Memory Floorplan Analysis
The Micron Technology B57T die is found inside Micron Technology MT29F2T08ELLLHL4-QA_L package. There is one Micron Technology MT29F2T08ELLLHL4-QA_L package in the Micron Technology MTFDKBA256TGE-1BL1AABYY 256 GB 22 × 80 mm M.2 form factor solid-state drive (SSD).
Automotive Semiconductor Vendor Share 2023 – STMicroelectronics closes in on NXP and Infineon
Infineon and NXP continued to lead the automotive semiconductor supplier rankings in 2023, based on TechInsights annual assessment of automotive semiconductor vendor share, which presents analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region.
Charging Infrastructure Database
This database provides a panoramic view of key players in the charging infrastructure business worldwide, including charging point manufacturers, charging point operators, and service providers.
Has Qorvo Given up on GaN?
Qorvo, which produces gallium nitride (GaN) based radio products for millimeter wave applications, announced it would acquire CMOS millimeter wave radio chip vendor Anokiwave. This raises the question: Does Qorvo plan to abandon GaN in favor of CMOS?
The Chip Insider® – Moore’s Law in the Angstrom Era
Now that EUV is working well and with higher NAs coming will there be smooth sailing in the Angstrom Era? How will it interplay with the new eras of AI and chiplets as we go beyond the AI, IDM, and Foundry eras?
Hybrid Si IGBT, SiC MOSFET Power Modules Add Efficiency to Motor Inverters Without the Cost
In March 2023, Tesla CEO Elon Musk said that the electric vehicle maker will use 75% less silicon carbide (SiC) without compromising the performance or efficiency of its models. TechInsights’ Stephen Russell gave predictions on how chip designs could enable this. But at the 2024 Automotive Tech Forum, vendors such as Infineon and STMicroelectronics, presented the answer: The hybrid power electronics module that uses both silicon and SiC devices.
3D NAND – Speed boost between NAND to SSD Controller
As the memory capacity of NAND packages increases with increased stacking of dies, issues such as large capacitive loading, input/output (I/O) speed reduction, and increased power consumption limit the packages from achieving the desired I/O speed, even when paired with a suitable SSD controller. This featured content report explores some recent NAND to SSD controller techniques.
Cockpit Innovations: Streaming, Gaming, Audio and Apps
TechInsights' report on cockpit innovations examines developments of in-car infotainment in audio streaming, video, and gaming, examining announced OEM partnerships, data and content service providers, and trends in displays.
Will there be an Apple M3 Ultra?
Dive deep into the absence of high-density interconnect pads in the M3 Max and its implications for the highly anticipated Apple M3 Ultra.
Research Bulletin – TSMC Climbs to #1, NVIDIA Posts Triple-Digit Growth in Final 2023 Ranking of Top 25 Semi Suppliers
Final calendar year 2023 ranking of the top 25 semiconductor suppliers are presented. No new suppliers broke into the top 25 list in 2023, but there were significant changes in where companies were ranked.
Apple A17 Pro SoC GPU Design Analysis
This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro 3 nm GPU, fabricated using FINFLEX methodology by TSMC. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.