This report presents a Basic Floorplan Analysis of the Espressif ESP32-C3 wireless combo SoC die found inside the Espressif ESP32-C3F component. The ESP32-C3 comprises a RISC-V single core CPU with support for 2.4 GHz Wi-Fi and Bluetooth low energy. The Espressif ESP32-C3F was extracted from the Espressif ESP32-C3-DevKitM-1 development kit. This report presents a Basic Floorplan Analysis of the Qualcomm HG11-YC990-110 die found inside the Murata 1XE wireless module.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process