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Latest Blogs and Commentary
How Much Carbon Does an AI-Generated Answer Emit?
The question sounds as though it should have a simple answer: select the accelerator, look up its power consumption, and calculate the emissions. Real AI infrastructure does not work that way.
HiSilicon CS5250: Huawei's First Self-Developed CMOS Image Sensor
TechInsights confirms Huawei subsidiary HiSilicon's 50 MP CS5250 CMOS image sensor in the Xiaotu S7 PRO MAX action camera. Explore preliminary teardown findings and learn how to access the full technical analysis.
Manufacturing Outlook 2027: Five Trends Reshaping Capex, Capacity and Fabs
Explore five trends shaping semiconductor manufacturing in 2027, including 27% capex growth, HBM’s impact on memory supply, packaging bottlenecks, 2 nm capacity and rising emissions.
AI Outlook 2027: Five Trends Reshaping AI Infrastructure, Compute and Memory
Explore five trends shaping the AI market in 2027, from AI infrastructure and compute to memory, advanced packaging and semiconductor manufacturing.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
Global Cloud Market Reaches $167.7 Billion in Q3 as Growth Hits 55%
The global cloud market reached $167.7 billion in Q3 2026, growing 55% year over year as AI demand and neocloud providers reshape the market. See this quarter's trends.
The Chip Insider®– SEMICON West wrap
Inside G. Dan Hutcheson’s latest analysis: More than 35,000 attendees examined shared industry challenges from geopolitics, power, and water to workforce, while big questions surfaced around CXMT’s DRAM, Terafab’s EUV access, and the next downturn.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
Memory Market Outlook 2027: Five Trends Reshaping HBM, DRAM and NAND
Memory will account for 62% of semiconductor revenue in 2027, as HBM demand, tightening NAND supply and capacity constraints reshape pricing, products and investment.
Supersizing AI: The Changing Role of Advanced Packaging
AI architectures are diversifying as inference, memory innovation, and new integration approaches change packaging requirements. TechInsights examines what these shifts could mean for advanced packaging suppliers.
2027 Outlook Webinar Series: AI, Packaging, Manufacturing & Sustainability
Register for three 2027 outlook webinars. Get the free Five Trends report now, plus every 2027 Outlook report as it publishes in the TechInsights Platform.
The Chip Insider®–Data Center water scare
Inside G. Dan Hutcheson’s latest analysis, the data center water debate takes an unexpected turn as he reveals why traditional cloud data centers and newer AI data centers have vastly different water demands and why AI may not be the water problem many believe it to be.
TechInsights Outlook 2027: Five Trends Reshaping the Market
Explore five trends shaping the 2027 semiconductor market, from memory constraints and AI infrastructure to advanced packaging, emissions and consumer demand.
Why Semiconductor Emissions are Outpacing Silicon Shipments
Semiconductor emissions are forecast to grow faster than silicon shipments through 2031. See how process nodes, electricity, and fab locations shape the outlook.
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