Availability
Published
Product Code
APQ-2310-801
Product Item Code
SAM-S5P9865
Device Manufacturer
Samsung
Google Tensor G3 System-on-Chip Samsung Fanout Panel Level Packaging Advanced Packaging Quick Look
The complete APQ deliverable includes concise analyst’s summary of critical device metrics and salient features supported by the following images:
- Downstream product teardown
- Package photographs and X-rays
- Die photographs
- Optical planar view images of selected printed wiring board (PWB) metal layers
- SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure
The Authoritative Information Platform to the Semiconductor Industry.
