Brief View the YMTC Xtacking4.0 Technology: What’s new on the chip?
Discover the key differences between YMTC Xtacking4.0 (Gen5) and previous generations. Explore TechInsights' in-depth analysis of structure, process, and design advancements from Gen1 to Gen5 in 3D NAND technology, highlighting cutting-edge innovations in storage density, speed, and energy efficiency.
Regarding the new YMTC Xtacking4.0 (Gen5) technology including structure, process, and design wins, what’s the differences from previous Xtacking2.0 (128L, Gen3) and Xtacking3.0 (232L, Gen4)? As TechInsights analyzed YMTC Gen1 (32L) through Gen4 and now for Gen5, we summarize the structure, process, and die design of each generation in Table 1. YMTC 3D NAND Gen1 was the first MLC chip for secure USB applications from YMTC, however, it was not the Xtacking (hybrid bonded) structure. YMTC Gen2 through Gen5 adopted Xtacking process with a two-wafer direct bonding technology. For Xtacking4.0 Gen5, YMTC integrated various cutting-edge technologies into the chip to increase storage density, higher speed, higher performance, and energy efficiency as well.
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