- Downstream product features and system-on-chip (SoC) level areas of analysis
- Technology node contact and back end of line (BEOL) process architecture assessment with stack-up dimensions
- Features and dummy structures of the SoC design overhead associated with the transition between design IP blocks
- Scanning electron microscope (SEM) montage image of the analyzed bevel areas delivered in CircuitVision
- Target areas are typically transitions between different types of IP blocks, such as analog I/O to digital, or to memory, and typically contain many dummy features
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