This is an Advanced Packaging Essentials of the Intel SRH4U Forevos3D package-on-package (PoP) technology. The Intel SRH4U processor was found in the Samsung Galaxy Book S tablet.

The complete APE deliverable includes a concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersiveX-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar view images of selected PWB metal layers
• SEM, TEM, and optical cross section of the general package structure, metals, dielectric materials, die, TSV and package interconnect structure