This report presents a Basic Floorplan Analysis of the Samsung S5N5X20X00 die found inside the Samsung S6565 component. The S6565 package was extracted from the Vivo X60 smartphone.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process