Product Code
APQ-2310-801
Release Date
Availability
Published
Product Item Code
SAM-S5P9865
Device Manufacturer
Samsung
Google Tensor G3 System-on-Chip Samsung Fanout Panel Level Packaging Advanced Packaging Quick Look
The complete APQ deliverable includes concise analyst’s summary of critical device metrics and salient features supported by the following images:
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of selected printed wiring board (PWB) metal layers
  • SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure
 

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