![](/sites/default/files/styles/product_featured/public/default_images/product_default_image_0.jpg?itok=603lYuM3)
- Downstream product teardown
- Package photographs and X-rays
- Die photographs
- Optical planar view images of selected printed wiring board (PWB) metal layers
- SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure
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