The new GlobalFoundries process combines photonic and digital components on a single 45nm chip. The primary application is data-center communications, but lidar and computing will benefit as well.

TSMC and Samsung have suffered lengthy delays in their 3nm processes, and the gain in density and other characteristics is smaller than in previous nodes. Intel says its future nodes are on schedule.

TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.