Availability
Published
Product Code
APE-2303-802
Product Item Code
AMD-100-100000908
Device Manufacturer
AMD
Device Type
Graphics Processor
AMD Ryzen 9 7950X3D TSMC SoIC Package Technology Advanced Packaging Analysis
This complete APE deliverable includes:
- Detailed analyst's summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features
- Downstream product teardown images
- Package photographs and X-rays
- Die photographs
- Optical planar view images of selected PWB metal layers
- SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure.
The Authoritative Information Platform to the Semiconductor Industry.
