Product Code
MFR-2102-803
Availability
Published
Product Item Code
SAM-S3NSN4VX
Device Manufacturer
Samsung
Subscription
Memory - Embedded & Emerging
Channel
Memory - Embedded & Emerging Floorplan Analysis
Samsung SN4VXC5 2nd Gen. 45nm eFLASH Memory Floorplan Analysis
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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