This report presents a Process Node Assessment of the Qualcomm P5523-12B antenna switch die found inside the EPCOS D5319 package.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Transmission electron microscopy (TEM) cross-sectional micrographs of the transistors and the gate oxide
• TEM-based energy dispersive spectroscopy (TEM-EDS) analysis of the dielectrics, metals, and transistors