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Latest Image Sensor Insights & Analysis

OmniVision OV50K Device Essentials Folder

This report provides an overview into the structure of the OmniVision OV50K CIS. The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.
2024 Jun 27

Omnivision OX08D10 Standard Floorplan Analysis

This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die.
2024 Jun 24

Omnivision OX08D10 Device Essentials Folder

This report provides an overview into the structure of the OmniVision OX08D10 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.
2024 Jun 21
2024 Image Signal Processor Video Briefing 1

2024 Image Sensor - Image Signal Processor Video Briefing 1

In this briefing, foundries and process nodes used to fabricate the devices are identified, and floorplan and layout are discussed including the area allocated to the analog to digital converters, digital processing, and embedded SRAM.
2024 Jun 10
Prophesee GenX320 Process Flow Analysis

Prophesee GenX320 Process Flow Analysis

 

Prophesee GenX320 Process Flow Analysis

2024 Jun 7
Sony A9 III Digital Camera Sensor (IMX810AQL) Device Essentials Folder

Sony A9 III Digital Camera Sensor (IMX810AQL) Device Essentials Folder

 

Sony A9 III Digital Camera Sensor (IMX810AQL) Device Essentials Folder

2024 Jun 4

Search our analysis and website

Apple-M5-Pro-Processor-analysis-cover

June 30, 2026

Apple M5 Pro Package Analysis: TSMC's SoIC-X F2F Hybrid Bonding in Consumer Computing

TechInsights analyzes the Apple M5 Pro APL1X15 package, revealing TSMC SoIC-X F2F hybrid bonding, CPU and GPU chiplets, silicon interposer routing, and verified die costs.

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Why the AI Memory Shortage Could Keep DRAM and NAND Prices High for Years

June 26, 2026

Why the AI Memory Shortage Could Keep DRAM and NAND Prices High for Years

AI-driven demand is creating the biggest memory shortage in history. Discover why DRAM and NAND prices are expected to remain elevated through the rest of the decade.

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DRAM-Market-Report-Q2-2026

June 24, 2026

DRAM Market Update Q2 2026: Why This Cycle Looks Different

Stronger-than-expected demand, rising AI memory requirements, evolving procurement models, and record profitability are transforming the DRAM market in ways that differ from those of previous cycles.

Learn More