Analysts Updates
Order Activity Is Straight and Level
With lead times for semiconductor equipment stretching well into 2022, equipment manufacturers are feeling increasingly optimistic about next year
Strategy and Tactics: Samsung’s Strategy Shift and Why We Climb Exponentials
This month was treated with SFF, or the 2021 Samsung Foundry Forum. As expected, it was a technology tour de force. What was unexpected was a fundamental shift in strategic positioning.
Applied Materials' Master Class on Process Control and Optimization
This was the latest of Applied's series intended to update investors on the nitty-gritty details of modern semiconductor technology, while showing why Applied is leading.
Semiconductor Sales Turned Up
Semiconductor Sales growth continues to slow due more to 2020 comps than a real decline.
Calmly Building Next Year's Nest
Memory activity slipped by another point but the decline was offset by SOC Mobile, which jumped higher
Semiconductor sales took a deep post-September dive last week
Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.
The Industry Is Soaring but Carries a Tether of Caution
Equipment suppliers continue to see a very strong level of activity which is why they expect 2022 to be another solid year for them.
Downturn Warning Signs. Excessive CapEx Exuberance
Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.
Semiconductor Sales Closing in on a Record $600m Year
Semiconductor sales closed in on $12B, another all-time weekly record. Semiconductor Sales are closing in on a record $600M in 2021 with 24% growth.
IBM’s Telum processor. Aart deGeus on EDA-AI.
IBM is a powerhouse in AI, as it has always been a powerhouse in semiconductor research. But this is often in the shadow of west-coast technology giants who dominate west-centric conferences.
Advanced Micro-Fabrication Equipment Inc. China earns its second triple crown
Provides state-of-the-art equipment, process knowhow, and all-star support to customers in front-end semiconductor manufacturing, back-end wafer level packaging, LED production, MEMS applications, and other semiconductor fabrication processes.
iPhone 17 Teardown Reveals Major STMicroelectronics IR Sensor Redesign
The iPhone 17 Pro Max introduces a major IR sensor redesign. See how STMicroelectronics’ new architecture reshapes biometric imaging.
Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.