Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
The Persistent Shadow of PFAS: A Green Tech Challenge for the Semiconductor Industry
Gain insight into how the semiconductor industry is tackling the PFAS challenge in manufacturing. Explore regulatory shifts, industry efforts, and the path toward sustainable alternatives.
The Chip Insider®–Trump’s Semiconductor Strategy
This edition of the Chip Insider® breaks down Trump’s semiconductor strategy, focusing on tariffs, TSMC, and its impact on U.S. chip policy.
MWC Barcelona 2025: Is Mobile AI a Game-Changer or Just Hype?
Find out if Mobile AI is truly revolutionary or just hype from TechInsights' coverage of MWC Barcelona 2025. Get the latest insights on its real-world value and future potential.
Renesas SoC Offers Boost for Industrial Motor Control
Unlock enhanced industrial motor control with Renesas' RZ/T2H SoC. Find out how it simplifies system design for Industry 4.0 applications.
Apple iPhone 16e Teardown
Discover the iPhone 16e teardown! Explore Apple's cost-saving design, the new Apple C1 5G modem, and key differences from the iPhone 16.
Navigating the Complexities of Semiconductor Sustainability Reporting
Learn how semiconductor companies are tackling sustainability reporting challenges and evolving regulations. Read the full TechInsights report.
Advanced Packaging Takes Center Stage at IEDM: A Focus on Multi-Chip Modules and Chiplet Technology
The 70th IEEE International Electron Devices Meeting (IEDM) in San Francisco showcased the growing importance of advanced packaging, particularly multi-chip module integration and chiplet technology, in addressing the escalating demands of artificial intelligence.
The Chip Insider®–TSMC-Intel tie-up endgame: A strategic forecast
Analyze the potential impact of a TSMC-Intel tie-up, exploring the stakes for key players, from Intel and TSMC to global political dynamics.
iPhone 16e Debuts with Apple’s First In-House 5G Modem and Enhanced AI Capabilities
Apple’s new iPhone 16e introduces the C1 modem, marking a major step toward modem independence from Qualcomm while delivering improved 5G performance and power efficiency.
Microprocessor Report January 2025 Review
Read the latest analysis on AMD’s Ryzen 7 9800X3D, Intel’s Twin Lake CPUs, and the rise of AI in edge technologies, along with key takeaways from CES 2025.
The Chip Insider®– Chiplet Integration Strategies for AI and HBM
The latest Chip Insider® blog breaks down chiplet integration strategies for AI and HBM, comparing system-down and chip-up approaches, economic impacts, and AMD's success in leveraging chiplets to gain market share.
AI GPU Growth Directly Impacts Carbon Emission Growth through 2030
Explore the forecasted impact of AI GPUs on the Carbon emission growth through 2023. Understand the factors such as HBM fueling the trend.
2025 Semiconductor Industry Forecast: Key Trends & Insights
Discover the top semiconductor trends for 2025, including AI-driven chip innovations, memory market shifts, and custom silicon advancements. View this free TechInsights report to stay ahead.
Chip Observer: February 2025
DeepSeek’s AI breakthrough shakes the market, U.S. tariffs and CHIPS Act funding uncertainty disrupt supply chains, and TechInsights uncovers major semiconductor advancements.
Intel Twin Lake budget CPUs are virtually identical twins of Alder Lake-N predecessors
Twin Lake-N is intended for low-power, budget-conscious designs, offering only single-threaded Gracemont E-cores first found in Alder Lake processors. True to the name, Twin Lake-N bears striking similarities to its Alder Lake-N predecessors.
The Chip Insider®– Can Intel be saved?
In the latest edition of The Chip Insider®, explore Pat Gelsinger’s strategy, potential Intel splits, government intervention, buyouts, and the challenges shaping its future.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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