Case Study
Using TechInsights' Mobile RF product to predict semiconductor equipment requirements for foundry and IDM customers
A leading semiconductor equipment manufacturer needed to determine the requirements imposed by the fabrication and packaging of RFIC on foundry processes and wafer fab equipment for their foundry and IDM customers over the next several years. The goal was to anticipate the equipment needs driven by the development of 5G, 5G-A, and 6G technologies. This involved understanding the specific process requirements and wafer counts for RF integrated circuits, including RF transceivers.
The Challenge
The organization sought detailed insights into requirements for the RFIC design for mixed signal, analog, RF and logic on the same die (RF transceivers) together with passive elements and ADC/DAC circuit performance. Without this critical knowledge, the company risked overlooking essential process and material requirements for next-generation RF technologies to be manufactured by their foundry and IDM customers, potentially affecting its long-term growth and competitive positioning in the RF semiconductor market.
The Solution
TechInsights’ Mobile RF provided comprehensive analysis of RF transceivers and Front-End Module dies – such as RF switches, low-noise amplifiers, and power amplifiers – found in leading 5G smartphones. TechInsights’ data revealed key trends in process design and materials used for both RFICs and their packaging, enabling the organization to anticipate future needs from its foundry and IDM customers. This foresight strengthened their ability to position themselves competitively for long-term growth in the RF and wireless markets.
TechInsights’ Mobile RF was used by the business to analyze:
- Die layouts for RF transceivers and other RFICs
- High frequency transistor structures
- Processes and wafer materials used for RF analogue and mixed signal RFIC
- Passive element construction for inductors and capacitors
- Foundry specific nodes and semiconductor processes
- Packaging for RF Transceivers, Front End Modules and AiPs
These insights identified emerging technology trends, guiding future investments in semiconductor equipment for 5G, 5G-A, and 6G applications.
The Results
TechInsights’ Mobile RF revealed market leading RF semiconductor processes and packaging from foundries and IDMs. This allowed the organization to accurately predict future semiconductor equipment requirements for the Mobile RF sector, strengthening its competitive edge. By gaining early visibility into RFIC die layouts, material choices, and packaging technologies from different vendors, the company was able to enhance its strategic positioning with foundry and IDM customers while reducing risk in its R&D development efforts for Mobile RF technologies.
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