AMD Instinct MI300X Processor Floorplan Analysis
Discover the digital floorplan analysis of the AMD Instinct MI300X processor, optimized for generative AI. Explore functional layout, memory blocks, and cost analysis.
The MI300X 215-186000396 component is a 76.8 mm × 72.0 mm × 4.9 mm (thick) 3D package which integrates GPU and I/O chiplets using TSMC’s system on integrated chip (SoIC) hybrid bonding technology to add another dimension of integration above the chip-on-wafer-on-substrate silicon (CoWoS) interposer. The MI300 Series incorporates up to eight vertically stacked GPU chiplets (Accelerator Complex Dies (XCD)) and four I/O dies (IOD) for system infrastructure, interconnected through AMD Infinity Fabric™ technology and integrated with eight stacks of high-bandwidth memory (HBM). This analysis includes node identification, BELO stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided.
