The Advanced CMOS Essentials (ACE) deliverable for Advanced Packing comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

• Downstream product teardown
• Package photographs and X-rays
• Top metal die photographs
• Optical cross section of general package structure
• SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
• SEM cross section of TSV, where applicable
• Optical and SEM bevel images of the package assembly