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Processor Analysis Subscriptions
Our unique combination of deep semiconductor industry contacts, data analytics, with databases and information libraries that reach back seven decades.
Our core coverage is of processors and SoCs for servers, PCs, supercomputers (HPC), smartphones, wearables, embedded systems, IoT devices, communications and networking equipment, and advanced automotive applications. We also cover licensable and open-source cores for CPU, DSP, graphics, and other functions. Many of our recent articles cover AI accelerators for cloud, edge, automotive, mobile, and IoT.

Combined with our locations in the world's technology hot-spots make us perfectly suited for the development of the world's most distinguished semiconductor market research.
Market Analysis Solutions
End Market Analysis:
The Processor Analysis Advantage
Our experts possess the unique combination of technical expertise and specific market knowledge to help you successfully navigate the complexities of these markets. With broad backgrounds in product design, marketing, management, and industry analysis, we deliver informed, real-world perspectives to your issues.
Processor Analysis
This industry-leading weekly journal covers new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
This annual subscription is updated quarterly and covers hardware technologies and products from more than 55 companies. The 300+ page report provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs, and why. TechInsights’ unique technology analysis provides a forward-looking view, helping sort through competing claims and products.
This subscription provides the detailed market information needed to sort out the complexities of the communications semiconductor market. With this analysis, chip vendors, investors, and OEMs will readily see how big the mature product markets are and how fast the emerging categories are growing.
US Hyperscalers Now Drive 15 of the World’s Top 20 Datacenter Markets
Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead.
High Bandwidth Memory in NVIDIA HGX B300: Examining the Micron HBM3E Package
Memory packaging has become a primary differentiator in AI accelerator performance. We take a look at Micron's HBM3E packaging architecture for the NVIDIA HGX B300.
Why the Advanced Packaging Semiconductor Market No Longer Moves as One
Advanced packaging does not move as a single market. See why packaging strategy increasingly depends on workload and application-based market data rather than on a single-processor view.




