Latest Blogs and Commentary
Apple Vision Pro Teardown
Discover the inner workings of the Apple Vision Pro A2117 with our in-depth teardown analysis. Explore its M2 processor, Micro-OLED display, sensor suite, connectivity options, and spatial audio technology.
The Chip Insider® – Taiwan’s Earthquake: Follow-up
Follow-up to the 5 April Chip Insider on the Hualien City earthquake. As predicted in this write-up, so far the earthquake has had no measurable impact. TSMC proved it definitively this time as their people polished the company’s reputation for being the “trusted capacity provider”.
Auto IC Sales growth muted YoY the week ending April 19, 2024
Semiconductor sales increased 1% last week and were up 23% from this time last year. Zooming in on Auto IC, the 13-week MA was flat YoY last week. TechInsights forecasts Auto IC sales will modestly increase 3% to $44 billion in 2024.
S32N Processors Consolidate ECUs
NXP’s new S32N55, part of a new S32N processor family and the newly announced CoreRide brand, centralizes core driving functions that are currently implemented in localized ECUs.
Deep Dive Teardown of the Caterpillar S75 BM1S1B Smartphone
The Main Cover is a Co-Molded Reinforced Plastic Frame. It consists of a Glass-Filled Plastic Inner Frame and Soft Plastic Outer Frame. Waterproof elements available in the construction of devices for: Sealed Buttons Port with rubber membrane, Sealing Tape around the Main Enclosures, Silicone Gasket on Sim Tray Cover, and Sealing Tape around Cameras Windows and Camera Window's Positioning Handle.
Deep Dive Teardown of the ecobee Smart Doorbell EB-CAMSDB-01 Doorbell Camera
The Ecobee Smart Doorbell Camera is a smart home security system unit equipped with a 175-degree vertical view camera. It can stream a live view to Ecobee Smart Thermostat through low energy communication system of BT 5.0 and 2.4/5 GHz WiFi.
Forecast: Global 5G Smartphone Wholesale ASP & Revenue by Technology to 2029
Global 5G smartphone wholesale revenues will surge between 2019 and 2029. 5G is by far the fastest-growing sector of the smartphone industry for the next decade. The majority of mmWave sales volumes will come from the North American market. Sub-6GHz will remain the main 5G technology for the foreseeable future.
SK hynix Hi-5021Q 50MP 0.70μm Pixel CMOS Image Sensor Device Essentials Plus
The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
Deep Dive Teardown of the Xiaomi Redimi K70 Pro 23117RK66C Smartphone
Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.
Deep Dive Teardown of the Fitbit Charge 6 G3MP5 Activity Tracker
The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.
Exploring Tesla's Full Self-Driving
Embark on a journey with TechInsights as we explore the world of Tesla's advanced Full Self-Driving (FSD) driving capabilities.
Ned May
Ned May Director, End Market Analysis Ned leads End Market Analysis at TechInsights which includes our coverage of Automotive, Mobile, Consumer Electronics and Telecom Strategies. He brings over 25 years of experience as both an advisor to and
Unlocking Insights: SoC Design Analysis Q1 2024 Briefing
This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.
Samsung K9DYGY8J5B-CCK0 236L 1Tb 3D NAND Internal Waveform Analysis
The Samsung 1 Tb 236L triple-level-cell (TLC) 3D NAND flash memory device (die markings: K9AKGD8J0B) is one of 16 dies packaged inside one Samsung K9DYGY8J5B-CCK0 NAND flash memory package, which was found in the MZ-V9P4T0 990 Pro PCIe 4.0 NVMe M.2 4 TB solid state drive (SSD).
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra Discover the groundbreaking technology behind Huawei's Pura 70 Ultra smartphone, powered by the innovative HiSilicon Kirin 9010 processor. Delve into our in-depth analysis by the TechInsights team
Sony LYTIA LYT900 50MP 1.6μm Pixel ISP Die Standard Floorplan Analysis
The Sony LYTIA LYT900 is a rear wide-angle camera module that was extracted from the Oppo Find X7 Ultra (PHY110) smartphone. The camera module measures 27.96 mm × 31.16 mm × 10.68 mm thick. It contains a stacked imager comprising a CIS die and an ISP die. This floorplan analysis (FAR) examines the ISP die.
Value Share: Global Smartphone Vendor ASP and Revenue Share by region: Q4 2023
Global smartphone industry revenues grew by 8% in Q4 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 3/4th of the global revenues. Apple was the leading vendor by revenues in all of the six regions tracked.
Forecast: Global 5G Smartphones by Technology up to 2029
We expect mmWave technology to reach 11% penetration of all 5G smartphones in 2023. The majority of sales volumes come from the North American market.