Posted: April 10, 2018
TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron
TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including:
We are excited to examine the different approaches of each manufacturer, and to provide the level of competitive analysis you require, from product-level teardown and bill-of-materials analysis to detailed die-level structural, process, and circuit information.
Intellectual Property Professionals
A successful IP strategy in this field requires an awareness of disruptive events in NAND, knowledge of key and upcoming market players, and the correct application of reverse engineering techniques to identify the changes from generation to generation of the latest NAND technology. Our analysis enables fact-based IP decisions in support of licensing, defense, acquisition, divestiture, and prosecution projects, and includes everything from product-level teardown and bill-of-materials analysis to detailed die-level structural, process, and circuit information.
9X Layer 3D NAND Analysis - Learn More
Download our overview of 3D NAND Analysis, complete with a market overview, NAND technology roadmap, die images, and an outline of the different analytical methods we can apply to these products.