The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
Apple iPhone 18 Memory Costs: DRAM & NAND Price Pressure
DRAM and NAND prices are rising through the iPhone 18 launch. See what higher memory costs could mean for Apple, AI, BOM costs, and smartphone strategy.
Apple iPhone 18 Pro: A20 Pro, Camera, C2 Modem & Key Changes
Explore what is new in the Apple iPhone 18 Pro and Pro Max, including the 2 nm A20 Pro, variable-aperture camera, C2 modem, cooling, and battery.
Can 2200 V PowiGaN Challenge Silicon Carbide?
Access TechInsights’ special report on Power Integrations’ 2200 V PowiGaN demonstration and its potential impact on high-voltage power semiconductor markets.
