Discover the HiSilicon Hi1105-GFCV150 die, uncovered inside its component from the Huawei Mate 70 Pro+—a glimpse into Huawei’s latest tech innovation!
The HiSilicon Hi1105-GFCV150 die was found inside the HiSilicon Hi1105-GFCV150 component. The HiSilicon Hi1105-GFCV150 component was extracted from the Huawei Mate 70 Pro+ smartphone.
5 Key Trends Shaping Automotive Electronics in 2025 and beyond
From AI and EVs to semiconductor demand and automated driving, join us to unlock exclusive insights!
Rethinking Water Use: Sustainable Tech and Operational Efficiency in Semiconductor Fabrication
Discover how the semiconductor industry is tackling water scarcity with advanced recycling, sustainable tech, and efficient water management. Learn how companies like TSMC and Intel are striving for water positivity while balancing innovation and environmental responsibility.
Discover the iPhone 16e teardown! Explore Apple's cost-saving design, the new Apple C1 5G modem, and key differences from the iPhone 16.
iPhone 16e Debuts with Apple’s First In-House 5G Modem and Enhanced AI Capabilities
Apple’s new iPhone 16e introduces the C1 modem, marking a major step toward modem independence from Qualcomm while delivering improved 5G performance and power efficiency.
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