SHiSilicon Kirin 9020 (Huawei Mate 70 Series, N+2) Floorplan Analysis
Digital Floorplan Analysis of the WH231203 die in HiSilicon Kirin 9020 from Huawei Mate 70 Pro Plus, covering structure, dimensions, layout, and die utilization.
This report presents a Digital Floorplan Analysis of the WH231203 die found inside the HiSilicon Hi36C0-GFCV110 Kirin 9020 processor extracted from the Huawei Mate 70 Pro Plus smartphone. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately. This provides information and insights into the design and process attributes that may relate to performance.
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