Intel Lunar Lake 16th Gen TSMC N3 I/O Tile Digital Floorplan Quick Look Analysis
This report provides a Digital Floorplan Quick Look (DFQ) of the Intel 8PUSC I/O die from the Core Ultra 7 258V (Lunar Lake) package, featuring a 2.5D Foveros assembly.
This report presents a Digital Floorplan Quick Look (DFQ) of the Intel 8PUSC I/O die found inside the Intel Core Ultra 7 258V (Lunar Lake) package (SRPMN). The package was removed from a MSI Prestige 14 AI+ Evo laptop. The SRPMN package consists of a disaggregated processor comprising a TSMC manufactured compute die along with an I/O chiplet (Platform controller die) and silicon dummy chiplet connected in a 2.5D Foveros assembly, mounted alongside two SDRAM memory package.
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