KIOXIA FXN5_512G 112L 512 Gb TLC 3D NAND Memory Floorplan Analysis
This MFR report analyzes the floorplan design of the KIOXIA FXN5_512G 112L 512Gb TLC die, including process node, foundry ID, critical dimensions, and die cost insights.
This report (MFR) provides an analysis of the floorplan design used in the KIOXIA FXN5_512G 112L 512Gb TLC die and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die cost analysis.
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