Murata 566 MHB L-PAMiD Packaging Analysis

Murata 566 MHB L-PAMiD Packaging Analysis

Explore TechInsights' package analysis of the Murata 566 mid high band power amplifier with integrated low noise amplifier and duplexer (MHB L-PAMiD) in the OnePlus Open foldable 5G handset.

This is a package analysis report on the Murata 566 mid high band power amplifier with integrated low noise amplifier and duplexer (MHB L-PAMiD) found in the OnePlus Open (CPH2551) foldable 5G handset. The Murata 566 MHB L-PAMiD is the first such module we have seen from Murata in a smartphone, signaling Murata's expanding capabilities into the PA/PAM and L-PAMiD space, competing directly with BCM, Qorvo, Qualcomm and Skyworks. Announced in October 2023, the OnePlus Open is a foldable smartphone with the Qualcomm SM8550-AB Snapdragon 8 Gen 2 processor and a foldable LTPO3 flexi-fluid AMOLED display.

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