Samsung Exynos 2400 Digital Floorplan Analysis
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This report presents a Digital Floorplan Analysis of the Samsung S5E9945 die found inside the Exynos 2400 component. The Exynos 2400 is the bottom package of SM-S926B/DS multi-chip package-on-package (PoP) assembly comprising the upper Samsung LPDDR5X memory package mounted on the Exynos 2400 application processor bottom package. SM-S926B/DS PoP was extracted from Samsung Galaxy s24+ smartphone release date is January 31st, 2024. The Samsung Galaxy s24+ comprises octa-core CPU with maximum speed of 3.39 GHz and 512 GB storage memory. The Galaxy S24 series is the latest lineup of Samsung flagship phones
The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately. This provides information and insights into the design and process attributes that may relate to performance. Additionally, foundry and process node identification, as well as cost analysis, are provided.
The information contained in this report is relevant to:
- Chip Fabrication/Foundries: Analyze the digital blocks layout and Identify process features used on the target device. This involves examining the structural aspects, critical dimensions, and layout of the digital blocks to understand the design and manufacturing techniques employed.
- Fabless/Chip Designer: Understand how competitors design their products and explore the know-how behind their design. This includes studying the design methodologies, architectural choices, and technological innovations used by competitors to gain insights and enhance one's own design processes.
