Samsung K9AHGD8J0FW 236L 512 Gb TLC 3D NAND Memory Floorplan Analysis
Detailed analysis of the Samsung KLUEG4RHHF-F0G1 UFS 4.0 memory package from the Vivo X200, featuring 3D NAND dies, imaging sets, process node details, and cost analysis.
The Samsung K9AHGD8J0FW die was found inside the Samsung KLUEG4RHHF-F0G1. The KLUEG4RHHF-F0G1 was extracted from the Vivo X200 V2415A smartphone. The KLUEG4RHHF-F0G1 is a UFS 4.0 256 GB mobile memory package that features four 512 Gb 3D NAND dies and one memory controller die. This memory floorplan report (MFR) provides an analysis of the floorplan design used and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die cost analysis.
