Case Study
How TechInsights’ Advanced Packaging Helped a Leading Semiconductor Manufacturer Optimize Thermal Performance and Boost Market Share
A leading manufacturer of semiconductors and software for consumer electronics, mobile communications, security applications, in-car entertainment, and networking must ensure they are selecting robust packaging technology for their semiconductors that ensures the reliability of their products once integrated into end devices and the applications they support. TechInsights Advanced Packaging provided a comprehensive solution, enabling the company to evaluate various cutting-edge packaging options and select the best fit for their needs.
The Challenge
Many of the organization’s products are used in automotive applications and other challenging operating environments such as engine control units, which operate under demanding thermal conditions that can affect reliability. If these conditions exceed the chip’s thermal limits, the business must develop innovative solutions to address these challenges. It was imperative for the business to be able to explore advanced packaging technologies that offer superior thermal performance tailored to their specific applications. Additionally, they required a method to evaluate whether these technologies could be adapted or customized for their products. Finally, staying informed about both emerging and commercialized packaging solutions was essential to better understand their suitability for integration into their products.
The Solution
TechInsights’ Advanced Packaging helped address the organization’s challenges by providing materials and stack-up data that enabled them to simulate and model the thermal performance of their product designs against various packaging technologies. Also included within Advanced Packaging is our comprehensive packaging roadmap that covers past generations, current technologies, and future trends which supported the business in exploring packaging technologies relevant to their specific applications and selecting the best fit for their product. Finally, TechInsights’ analysis was used to anticipate emerging technologies from leading companies and assess their relevance to their chipset products. For example, the company could determine if new packaging technology from foundry partners or OSATs would meet their end product requirements, such as improved thermal management with necessary integration changes.
The Results
Utilizing best practices from TechInsights’ Advanced Packaging analysis can minimize development uncertainties, accelerate time to market, and boost product reliability, all of which strengthen the company’s competitive edge. By applying these insights, the organization could potentially de-risk strategic technology choices, shorten product development timelines by 3-6 months and capture an additional 1-2% market share in the automotive sector due to earlier market entry.
This case study outlines how TechInsights analysis can also help your company.
Working closely with our customers we provide a detailed breakdown of analysis related to their specific requirements ensuring we are a trusted partner in their continued focus on quality and execution.
Enter your email to register to the TechInsights Platform and access analyses, daily content updates, and more.
