- Package optical photographs, package X-ray images, die photographs, optical photographs of die features
- Scanning electron microscopy (SEM) plan-view images of the device delayered to the gate level
- Exploratory cross-sectional plan-view SEM images of the device structure
- Detailed cross-sectional scanning microwave impedance microscopy (sMIM) analysis of the dopant structures
- The image set for a standard PEF project is derived from a delayered sample for SEM planar analysis, a single plane of cross-sectioning for SEM structural analysis, and a single sMIM sample for the detailed structural analysis. Value add information such as additional planes of cross-sectioning, may be included on a case-by-case basis
The Power Essentials deliverable provides basic competitive benchmarking information and enables cost-effective tracking of multiple competitors’ technology.
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