Antenna-in-Package (AiP) Technology for 5G and beyond
A Comparative Analysis of Advanced Modules from Flagship Devices (Qualcomm, Murata, USI, MediaTek)
Discover the latest in Antenna-in-Package (AiP) technology for 5G and beyond. This report compares advanced AiP modules from Qualcomm, Murata, USI, and MediaTek, showcasing innovations in wireless packaging.
5G and further evolution of wireless connectivity will have a more profound impact on our lives than any technological shift since the advent of the Internet, as it paves the way for a fully connected world. The implementation of 5G is driving the development of new packaging technologies, moving beyond traditional RF packaging methods. This report is a comparison of different antennae in package modules, drawing upon the findings from package and module architecture analysis.
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