Microprocessor Report August 2024 Review
Author: David Macqueen
Explore insights from Hot Chips on AMD, Mindgrove, Intel's 3 process with TSVs for Xeon 6, and new datacenter products from IBM, Ampere, Microsoft, and Furiosa, highlighting the growing traction for RISC-V.
AMD and Mindgrove devices were under the microscope. The Intel 3 process, which is already in production for Xeon 6 processors, is the company’s first to include through-silicon vias (TSVs). Our team attended Hot Chips where we saw new datacenter products from IBM, Ampere, Microsoft, Furiosa, and the Intel 3-based Xeon 6 chips from Intel. A key takeaway from the conference was the traction building around RISC-V.
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