ams OSRAM TMF8806 1D Time-of-Flight Sensor Packaging Analysis
1 Min Read June 27, 2025
Get insights into ams OSRAM TMF8806’s cross-talk-reducing package, with key dimensions and material analysis.
The ams OSRAM TMF8806 implements packaging strategies to reduce cross-talk between VCSEL emitter and SPAD sensor. The package comprises a multi-window partially partitioned plastic case mounted to a PWB, combined with transparent encapsulation. This report documents critical dimensions and material analysis of that structure.
