Enflame S60 AI Accelerator Processor Floorplan Analysis​

 

  2 Min Read     February 3, 2026

 
 

Enflame’s S60 AI accelerator is unpacked as TechInsights analyzes the SCORPIO‑AO chiplet, detailing node, die usage, and manufacturing costs.

Enflame S60 AI Accelerator Processor Floorplan Analysis

The Enflame S60 is Enflame's third-generation artificial intelligence (AI) accelerator card. This report analyzes the compute chiplet, SCORPIO-AO, with "ENFLAME SCORPIO-AO" die markings. It was manufactured by TSMC using N6NTO-HPC. This analysis includes node identification, BEOL stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided.

 

This summary outlines the analysis* found on the TechInsights' Platform.

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