Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis
2 Min Read June 03, 2026
Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis, a multi-die module packaged in a 56-pin LGA.
The Qualcomm QPM7375A Mid/High Band (MHB) Power Amplifier Module with Low Noise Amplifier and embedded duplexers (L-PAMiD) is a multi-die module packaged in a 56-pin LGA (Land Grid Array) that measures 7.42mm x 6.21mm x 0.73mm. It contains six active dies (2 PAs, 1 LNA, 3 RF Switches, and 1 RFFE Controller) and five Surface Acoustic Wave (SAW) filter dies. The QPM7375A used in this analysis was taken from the Xiaomi 17 Pro Max (2509FPN0BC) smartphone from China.
This summary outlines the analysis* found on the TechInsights' Platform.
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