2nm Semiconductor Process Comparison
Intel 18A vs Samsung SF2 vs TSMC N2 — What the First Chips Reveal
Samsung SF2 yields are in the 50–60% range. TSMC N2 is in high-volume production. Intel 18A has entered manufacturing. The 2nm era is real — but not all processes are equal, and the first products aren’t AI datacentre chips. Join TechInsights semiconductor experts to analyse Intel Panther Lake on Intel 18A, Samsung Exynos 2600 on SF2, and SMIC’s new logic folding technique — with gate-all-around transistor analysis, BoM teardown data, and a demonstration of Insightful Chat AI Agents surfacing these insights directly from the TechInsights Platform.
What You’ll Learn
Most coverage of 2nm semiconductor processes focuses on AI datacentre chips — but the first high-volume products on Intel 18A, Samsung SF2, and TSMC N2 are smartphones and laptops, not GPU clusters.
That matters for anyone tracking foundry capacity, semiconductor process performance, gate-all-around (GAA) transistor yield, advanced node BoM cost, or the carbon footprint of next-generation chip manufacturing. This free webinar brings together TechInsights’ reverse engineering, market intelligence, procurement, and sustainability experts to decode what primary reverse engineering data actually shows — and demonstrates how Insightful Chat AI Agents draw on TechInsights Platform content to accelerate the research workflows your team relies on.
The 2nm Process Reality: Are All 2nm Nodes Equal?
- Why Samsung’s SF2 looks more like an evolution of SF3 than a step-change
- What the Exynos 2600 floorplan reveals about GPU vs. NPU priorities
- How SMIC’s logic folding technique stacks up — and why thermals matter even more
Strategic Implications: Who Has Capacity, and Who Can Win Business?
- Availability of 2nm processes across TSMC, Samsung, and Intel
- TSMC lead times exceeding one year — what that means for Samsung and Intel
- Counter-narrative: 2nm’s first movers are high-volume consumer products, not low-volume AI chips
Procurement and BoM Impact: Design Decisions Drive Cost
- How Samsung’s modem-off-SoC decision affects Bill of Materials
- Comparing Apple’s integrated C1 modem approach to external modem designs
- What we expect for Apple’s 2nm generation and SMIC’s logic folding chips
Sustainability: The Carbon Footprint of Design Trade-offs
- How shifting components off the SoC changes the carbon story
- If SF2’s primary advantage is improved yield, what does that mean for carbon footprint?
- Live example: using Insightful Chat to model the sustainability impact of yield improvement
Insightful Chat AI Agents - Live Platform Demonstration
You'll also see a live demonstration of TechInsights' Insightful Chat AI Agents in action, showing how they draw directly from TechInsights Platform content to deliver trusted, real-time answers.
Discover how AI Agents streamline customer workflows across research, competitive benchmarking, procurement analysis, and sustainability modelling, enabling teams to answer complex semiconductor questions in seconds using the proprietary data only TechInsights can provide.
Why Attend
Intel 18A, Samsung SF2, and TSMC N2 represent fundamentally different approaches to 2nm-class semiconductor manufacturing, and the design and process decisions being made right now will shape foundry competitive positioning, advanced node chip costs, supply chain strategies, and sustainability commitments for years to come. Whether you’re benchmarking gate-all-around process performance, modelling BoM cost impacts of SoC design choices, assessing foundry capacity for advanced nodes, or quantifying the carbon footprint of semiconductor manufacturing, this webinar delivers primary intelligence that no analyst report or press coverage can replicate - backed by TechInsights’ proprietary reverse engineering and teardown analysis.
You’ll also see a live demonstration of how TechInsights’ Insightful Chat AI Agents draw on Platform content, turning semiconductor intelligence queries on 2nm process comparisons, foundry yield data, and chip carbon footprint into fast, actionable answers that integrate directly into your team’s research and decision-making workflow.
Who Should Attend
- Semiconductor engineers and R&D professionals tracking process node developments
- Strategy and competitive intelligence teams at foundries, IDMs, and fabless companies
- Procurement and supply chain professionals managing component costs and BoM decisions
- Sustainability leaders tracking carbon implications of design and process choices
- Product managers and technology strategists planning roadmaps around advanced nodes
- Anyone looking to understand how AI Agents can be integrated into semiconductor research and decision-making workflows
Invaluable Insight from Industry-Recognized SMEs
Learn from leaders who bring decades of semiconductor expertise, real-world experience, and a track record of impactful research.
David MacQueen
David MacQueen serves as Director of Executive Insights at TechInsights, covering the semiconductor value chain to identify emerging technologies and new research opportunities, while ensuring alignment across TechInsights’ research output. With over 20 years of experience in semiconductor-related industries, David has an instinctive ability to contextualise complex data and help clients understand the big picture. Previously, David served as Director of Wireless Media Strategies at Strategy Analytics and as Head of Mobile Media Intelligence at Screen Digest.
Boris Metodiev
As Director of Semiconductor Manufacturing Analysis at TechInsights, Boris Metodiev leads the team recognised for setting the standard in semiconductor manufacturing consultancy and advisory. His expertise spans the semiconductor manufacturing supply chain and market analytics — including forecasts, capacity, equipment, industry structure, market drivers, and pricing. Boris is frequently quoted in media publications and maintains an active schedule of conference appearances and vendor briefings.
John Boyd
John Boyd is a Product Manager at TechInsights, bringing extensive experience across semiconductor manufacturing, equipment, and intelligence products. With a background spanning roles at Lam Research, Strasbaugh, Semiconductor Insights, and Nortel Networks, John brings deep technical and commercial expertise to TechInsights’ platform and product development.
Gibson Peters
Gibson Peters is a product leader with 20 years of experience building sustainability-focused products. He holds an MS in Engineering and an MBA, and is a recognized expert in carbon accounting for manufacturing — a domain in which he holds a U.S. patent for calculating embodied carbon in manufactured parts. His work has earned multiple awards for innovation and impact.
Jagrut Patel
Heads our Teardown, Pricing & Costing products within TechInsights. Prior to joining TechInsights, Jagrut was US head of benchmarking at Nokia. Jagrut has more than 25 years of experience in product development, product management and competitive intelligence in AT&T/ Lucent/ Alcatel-Lucent & Nokia. He led competitive assessments, reverse engineering, design consultations, target cost/ feature settings and used this to advise supply chain, product management and executives in making portfolio decisions to increase portfolio competitiveness.
Choose the Session That Works for You
Join TechInsights for an exclusive comparison of Intel 18A, Samsung SF2, and TSMC N2. With two live sessions available, you can attend at the time that's most convenient for you and gain exclusive semiconductor intelligence, live AI demonstrations, and expert insights.
