A10 Fusion Processor

Apple’s part number for the A10 is APL1W24, 339S00255 vs the Apple A9, which was APL1022, 339S00129. We are not certain what the addition of the ‘W’ in the new number signifies. As we mentioned above, our iPhone 7 A1778 had an A10 application processor from TSMC. If you remember on the iPhone 6S, both Samsung and TSMC supplied the A9 processors. As of this writing we do not know if that is still the case, or if the A10 is being single sourced from TSMC.

Our die photo of the A10 shows a die part number of TMGK98 which is continuing up in sequence from the A9’s TMGK96. The A10 die size is ~125 sq. mm with a reported 3.3 billion transistors.

We have confirmed the process to be TSMC 16FF-based, so this means that Apple has basically been in the same 20/16nm technology for the last 3 generations, and it took 2 iterations on FinFET for Apple to get the A10 back to the gate densities we saw in the A8, optimized on a planar process.

A notable difference from the A9 to the A10 is much tighter SoC-level die utilization, which is more in line with the A8. This, along with tighter 9-Track and 7.5-Track libraries of an 16FFC process, are expected to have kept the die from bloating to the ~150 sq. mm level that we were expecting from a straight scale of the A9 to the A10, in terms of transistor count.

It has been impressive how architectural and design techniques have exploited the device-level performance boost from 20nm planar to 16FF FinFET, and the expected improvement in 16FFC, to continue the speed improvement and power reduction, despite the lack of gate-level scaling. This goes to show that there is a lot more to SoC optimization than just scaling, and makes it all the more important to understand how to best squeeze performance out of the latest or previous technology nodes.

A10 Fusion Processor

UPDATE: We have revised our first A10 floorplan with help from our friends at AnandTech in the search for the small, high-efficiency cores. Our combined guess is that it is likely they are indeed integrated within the CPU cluster next to the big, high-performance cores. This makes sense given the the distinct colour of the small cores indicating a different digital library, and the position of the big core L1. Thanks to our friends over at Anandtech for reviewing the floor plan with us and providing input on where these blocks might be located!

Beyond the die, one important factor for performance, has been achieved via packaging. The A10 processor is incredibly thin, giving credibility to the reports that TSMC’s InFO packaging technique is being used.

The A10 sits below the Samsung K3RG1G10CM 2-GB LPDDR4 memory. This is similar to the low power mobile DRAM as the one we found in the iPhone 6s. Looking at the X-rays we see the four dies are not stacked, but are spread out across the package. This arrangement keeps the overall package height to a minimum. Assembled in a package-on-package assembly with the A10 InFO packaging technique reduces the total height of PoP significantly.

RF Transceiver

Intel continues their win in the iPhone 7 with two Intel PMB5750s, or what they call their SMARTi 5 RF Transceivers. Here again, TSMC wins as well, as the SMARTTi 5 RF transceivers are built on TSMC’S 28nm process (source: Linley Group Mobile Chip Report). TechInsights has done a circuit analysis report on a previous generation; the Intel PMB5747.

Microphones

As per normal multi-source philosophy of Apple, the microphones are being supplied by a few well known qualified vendors. In our model A1778, we have two microphones at the bottom of the phone and two up at the top.

The microphones at the bottom are sourced by Goertek and Knowles. The microphones on the upper part of the phone are Goertek and Knowles.

Looking over at the iFixit teardown of the iPhone 7 Plus we see STMicroelectronics has also scored design wins into the iPhone 7 Plus.

Cameras

Cameras have become such an important feature of any smartphone, and maybe even more so for the iPhones, Samsung Galaxy phones, now even Huawei is jumping all in with their dual camera on their latest flagship the Huawei P9. At this point, the camera of the iPhone 7 is in the lab to determine who made what, and the optical image stabilization source.

iSight Camera

iPhone 7’s iSight camera has a larger, ƒ/1.8 aperture, as compared to the ƒ/2.2 aperture used for iPhone 6s/6s Plus. The 10.6 mm x 9.8 mm x 5.7 mm thick iSight camera module features optical image stabilization (OIS) and a six-element lens. Although the 12 MP resolution and 1.22 µm pixel pitch hasn’t changed, the iSight’s camera chip is advertised as being 60% faster and 30% more efficient than its predecessor.

The iSight camera chip was sourced from Sony and fabricated using its Exmor RS technology platform. The 12 MP chip features a Bayer RGB color filter array (CFA) and embedded phase detection autofocus (PDAF) pixels. The die size is 5.16 mm x 6.25 mm (32.3 mm²) as measured from the edges of the die stack. We expect our planned analysis will show the CMOS image sensor (CIS) die to be fabricated by Sony in its 90 nm technology generation. The through silicon via (TSV) patterning tells us it’s a 2nd generation Exmor RS sensor and not 3rd generation Exmor RS with direct bond interconnect (DBI). The TSVs are used to connect the CIS chip to an underlying image signal processor (ISP), which is not to be confused with the complementary ISP functions embedded within the A10 chip.

We are anxious to see the results of our technical analysis of the iSight’s ISP. Sony originally stacked its Exmor RS CIS chips with 65 nm generation ISPs, then 40 nm and most recently 28 nm bulk CMOS. There have been rumors of Sony collaborating with GLOBALFOUNDRIES for stacked chip ISP production on 22 nm FDX, however with an announced mass production date of mid-2017 it is likely not in use in the iPhone 7.

FaceTime Camera

NFC Controller

We found an NXP NFC Controller with package markings 67V04 (likely PN67V) in the iPhone 7. We will decap it to get the die photo to see if it is a new designed NFC controller. For your reference, the previous iPhone 6S had the NXP PN66V10 NFC Controller, which has the die PN549. TechInsights has done a circuit analysis report of the NXP PN549.

GPS

Broadcom wins the slot in the iPhone 7: BCM47734. This possibly contains Sensor Hub functionality as well like BCM4773 & BCM4774 seen in Samsung devices. Apple did announce the A10 has its own sensor hub, so if the BCM47734 does have a sensor hub it may not be utilized here in the iPhone 7.

RF Front-end

This time around (or at least in this version), Apple opted to use Skyworks for their GSM PA only, but not for any of the Low, Mid, or High band PA Modules. Those were covered by Avago (Broadcom) and Qorvo. Qorvo parts are now beginning to be marked Qorvo now rather than TriQuint or RFMD. Skyworks wasn’t left out though, and seemed to push out Murata for some of the Diversity Receive Modules used at the top end of the phone (although Murata did get the WiFi/BT Module socket). TDK-EPC has been making a single appearance in the last couple of iPhones and iPads, while this time we find what looks like to be filter bank sockets located centrally between the two Intel RF transceivers. The following table highlights the RF design wins.