Product Code
FAR-1810-801
Availability
Published
Product Item Code
NXP-100VB27
Device Manufacturer
NXP Semiconductors
Device Type
NFC Controller
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
NXP Semiconductors 100VB27 NFC Controller Basic Functional Analysis
This report presents a Basic Functional Analysis of the NXP 100VB27 die found inside NXP 100VB27 package.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and diephotographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, majorfeatures, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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