Integrated Device Manufacturer
TechInsights empowers Integrated Device Manufacturers with leading semiconductor insights and industry analysis for building winning products.
Our comprehensive analysis enables IDMs to stay ahead of the curve by benchmarking their chip designs against competitors, making well-informed decisions backed by valuable data, and strategically planning for future developments in the semiconductor market.
Your IDM Semiconductor Source
Through TechInsights, you can subscribe to IDM semiconductor products and multiple add-ons all in one place.
Executive Insights
Timely, rapid insights on the megatrends shaping the semiconductor value chain.
Sensors
Deep technical analysis to better understand image sensors and image processing as a key point of differentiation in the market.
Compute
Leverage TechInsights to continue driving innovation and differentiation through superior SoC design.
Storage
Make data-driven design choices, know the competitive landscape and understand the memory market dynamics.
Mobile RF
Refine your product roadmap, align with industry trends, and outpace competitors, ensuring your success in the challenging 5G Mobile RF landscape.
Power Semiconductors
Deep technical analysis on the latest innovations in energy-efficiency, power management, and low-power solutions to help you stay competitive and align your strategy.
Smartphones, Tablets, and Wearables
Insights into emerging trends and enabling technologies critical to the future.
Using TechInsights Semiconductor Manufacturing Economics to Ensure Competitive Pricing and Diversify Their Supply Chain
Discover how an Integrated Device Manufacturer for wireless communications utilized TechInsights Semiconductor Manufacturing Economics to secure competitive pricing and diversify their supply chain.
Add-on Products
Add-on semiconductor products provide supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.
Semiconductor Manufacturing Economics
Supply relationship and activity databases for semiconductor growth areas and detailed volume forecasts for chips in automotive and consumer electronics markets.
BOM Database and BOM Database with Subsystems
TechInsights' BOM costing and design wins database contains three decades of accumulated semiconductor data from our Teardown analysis of consumer electronics products.
Component Price Landscape (CPL)
Leading index for tracking 140+ commodity EE component categories and 50,000+ MPNs, aiding purchasing decisions.
Semiconductor Manufacturing Carbon Model
Detailed, bottom-up analytics around carbon emissions including company and fabrication specific process and facility calculations, models training edge, current and projected 300mm processes, and more.
Component Price Analyzer (CPA)
The CPA tool examines the Bill of Materials (BOMs) for individual customers in the field of electrical engineering. CPA compares the prices of components provided by the customers with the average market prices based on their purchase volume.
Handset Cost Model
The Handset Cost Model is a budgeting tool that estimates unit costs based on features like development stage, launch targets, volume, ASP, 4G/5G, displays, cameras, and SoC chipsets, allowing users to optimize specifications to meet business goals.s
High Performance Computing
The High Performance Computing product delivers reverse engineering analyses of advanced packaging, SoC designs, chiplets, and high-bandwidth memories (HBM) for data centers and enterprise servers.
Expand Your IDM Semiconductor Products
Our advanced packaging coverage empowers IDMs by providing insights into competitive technical design, integrated design and manufacturing cost analysis, and market sizing by application. These insights, including analysis of chiplet integration, enable IDMs to optimize their end-to-end processes, from design through to manufacturing, balancing performance with cost. Additionally, our targeted analysis helps minimize feature sizes and pitch, crucial for staying competitive. This information is invaluable to your engineering, product management, and executive leadership teams, driving efficiency and innovation across the entire product lifecycle.
Offering
What's included
The Advanced Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
- Packaging
Semiconductor Manufacturing Drivers
Semiconductor Manufacturing Drivers provide critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Market Data
Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- Demand Forecasts
- EE Component Usage Across Products
- Inquiry Privileges
- Market Data
- Supply Analysis
- Product Features
Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Packaging
- Process
Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Process
Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.
- Block Diagram
- High Resolution Images
- Packaging
SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
- Product Features
Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
- Block Diagram
- Component Price and Lead-time Trends
- Competitor Analysis
- EE Component Usage Across Products
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
- Packaging
- Performance Analysis
- Process
- Product Features
Gain critical insights into the automotive industry to design processors that meet rising demands. Utilize forecasts, research, and teardown analysis to confirm the growing popularity of user experience features. Our coverage helps IDMs optimize design and manufacturing, ensuring competitiveness and innovation.
Offering
What's included
ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features descriptions and dimensional data
- Costed bill of materials (BOM) spreadsheets
- RF block diagrams
- System block diagrams
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
ADAS Design Material and Assembly Teardown
ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:
- Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions
- Images of subassemblies and their major components
- Weights and dimensional attributes of key components
- Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*
- Surface treatments*
- Thermal solutions
- Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
- IC selection
* = Where identifiable
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for feature descriptions and dimensional data
- Costed bill of materials (BOM) spreadsheets
- RF block diagrams
- System block diagrams
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.
- Block Diagram
- Cost Analysis
- Demand Forecasts
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Market Data
- Product Features
The Automotive coverage area integrates analytics from both the demand perspective of the automotive sector and the supply dynamics of semiconductors. The demand forecast tracks the dominant automotive semiconductor components such as processors, power, memory, DSPs, ASICs, image sensors, optoelectronics, among others. Additionally, the analysis provides a examination of market shares and financial profiles for top-tier automotive semiconductor firms, as well as the production capabilities of the foremost Integrated Device Manufacturers (IDMs).
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for feature descriptions and dimensional data
- Costed bill of materials (BOM) spreadsheets
- RF block diagrams
- System block diagrams
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for feature descriptions and dimensional data
- Costed bill of materials (BOM) spreadsheets
- RF block diagrams
- System block diagrams
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
LiDAR Design Material and Assembly Teardown
LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagrams
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Powertrain, Body, Chassis and Safety
Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Refine your strategy in the tablet and laptop markets with our in-depth analysis of 5G, eSIM, and Wi-Fi advancements. Our coverage of OEM strategies, consumer trends, and diverse form factors helps IDMs optimize product designs and align production strategies with current technologies. Use our insights to anticipate market shifts and adjust your product roadmap, ensuring competitiveness and innovation in manufacturing.
Offering
What's included
Notebooks and Tablets Teardown
Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Data Center / Cloud Semiconductors
The Data Center / Cloud coverage area offers an integrated perspective on the essential components of global data centers for the upcoming five years, encompassing memory, storage solutions, CPUs, AI/GPU accelerators, and server infrastructure. This comprehensive analysis spans both private data centers and public cloud environments. It features a comparative evaluation of top public cloud providers, projecting service hours and hardware requisites. Additionally, the report includes an assessment of hardware market shares, highlighting dominant manufacturers in server, CPU, and accelerators.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Personal Computing Semiconductors
Coming soon!
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Understand the consumer electronics landscape to improve design and production planning. IDMs can leverage our validated demand data, cost analysis forecasts, teardown analysis, and industry insights to align your production plans and better compete in the market. Our comprehensive insights ensure your production strategies are optimized for efficiency and competitiveness.
Offering
What's included
Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Connected Home Devices gives you instant access to our extensive supply-side research and analysis of the latest trends impacting the global consumer electronics market. Served through the TechInsights Platform, you can view our current and historical forecasts and market trackers, read our expert commentary, and understand the competitive landscape across a range of product categories including Flat Panel TVs, Game Consoles, Wireless Speakers, Soundbars, Set-Top Boxes, Streaming Media Players and eBook readers.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Connected TV Strategies is designed to help players across the CTV ecosystem from device vendors to content owners and service providers navigate the transition from legacy TV to streaming TV. CTVS combines detailed quarterly vendor and OS share tracking of connected TV devices with deep insights into the key trends shaping the market and the implications for content owners. CTVS offers customers an objective, research-driven approach to addressing the central strategic questions facing the CTV hardware, media and entertainment industries today.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Consumer Electronics Semiconductors
Coming soon!
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Emerging Device Technologies delivers fast-moving shipment tracking and sales forecasting of the key technologies powering modern smartphones and emerging classes of new devices. EDT identifies the key technologies powering smartphones right now and which will emerge in the future, such as artificial intelligence or 5G mmWave. Technology is the lens used to track device shipments and sales for individual vendors across the globe down to the country level.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Gaming Teardown is the world's largest teardown library, housing an impressive collection of devices analyzed per year. Our industry-agnostic approach provides unbiased analysis to empower fact-based decision-making. Delve into the design philosophies and discover the design wins behind these innovative creations. With over 30+ teardowns conducted annually, our expertise has been relied upon by leading OEMs, semiconductor manufacturers, and component companies for more than 25 years.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Notebooks and Tablets Teardown
Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Personal Computing Semiconductors
Coming soon!
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Smart Home Strategies tracks devices and focuses on emerging opportunities in home monitoring, energy management, and home control systems and services. After many years of market exploration and trials, digital and IP technologies are finally enabling widespread commercial service deployments which allow consumers to control and interact with their home security, energy and management systems. Smart Home Strategies builds on TechInsights’ 40-year heritage in exploring emerging home technology, application and service opportunities and identifies the key factors for success in this next stage in the digital home’s evolution.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Smart Home Teardown provides analyses on an assortment of products ranging from operator deployed Set-Top-Boxes and OEM media streaming devices to smart speakers, Wi-Fi routers, and surveillance cameras. Get insights on costing trends and design techniques across the smart home ecosystem. Sample manufacturers include: Amazon, Google, Roku, Apple, Samsung, Sony.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Wearable Device Ecosystem gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. It also delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share, and price.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Wireless Smartphone Strategies
Wireless Smartphone Strategies provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier, and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarters and country-level smartphone forecast data for the next 5 years are provided.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Executive Insights provides a high-level view to contextualize our deep, comprehensive data. Understand how megatrends like AI, geopolitics, and macroeconomic factors affect the semiconductor industry. Appraise product launches and corporate strategic shifts from a wide perspective. IDMs can leverage our range of weekly and monthly data sets and insights to optimize strategies and stay ahead of industry trends.
Offering
What's included
The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.
- Inquiry Privileges
- Insight Reports
The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.
- Inquiry Privileges
- Insight Reports
Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
- Block Diagram
- Component Price and Lead-time Trends
- Competitor Analysis
- EE Component Usage Across Products
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
- Packaging
- Performance Analysis
- Process
- Product Features
Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Semiconductor Industry Performance
Semiconductor Industry Performance content provides a unique view into the health of the semiconductor manufacturing ecosystem, including key performance indicators across electronics, semiconductor, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.
Gain insights into the market by delving into advancements in image sensors and image processing. Explore detailed analyses from die sizes to signal paths, revealing insights into competitors’ roadmaps, pixel architecture, mixed-signal noise-cancelling circuit design, and AI integration. IDMs can optimize product development and strategic planning by accessing expert evaluations and proprietary data. Ensure your innovations stand out in a crowded market with our comprehensive coverage.
Offering
What's included
Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.
- Circuit
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Packaging
- Process
Device Essentials Plus (DEP) is an extension of SEM-based Device Essentials (DEF), performed on a subset of the annual DEF targets. DEP offers thorough structural and dopant analyses using TEM, TEM-EDS, TEM-EELS, SCM/sMIM, and SIMS analytical techniques.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Process
Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.
- Competitor Analysis
- IC Floorplan
- Inquiry Privileges
- Insight Reports
Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.
- Competitor Analysis
- Data Visualisation
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process Flow
The Sensors coverage area offers insights into the market share and future trends of smartphone fingerprint and image sensors. It tracks the shipments of image sensors by model, complete with detailed sensor specifications. This coverage also provides a forward-looking five-year forecast, breaking down unit shipments, revenues, and Average Selling Price (ASP) across both Imaging and 3D Sensing CMOS Image Sensor (CIS) segments. Fingerprint sensor coverage, includes shipments, revenue, and ASP and is further categorized by vendor and technology, offering a granular view of the market landscape.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Enhance IoT SoC development with targeted analyses on Transceiver Architecture and Floorplan, essential for advancing smart home devices, wearables, and routers. Our insights fuel R&D, fostering innovations that align with market leadership goals and ensure your products not only lead but define the IoT market through seamless technology integration. IDMs can leverage our coverage to gain competitive design strategies, including insights into manufacturing costs and telecom trends across key wireless standards.
Offering
What's included
IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.
- Competitor Analysis
- IC Floorplan
- Inquiry Privileges
- Insight Reports
IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.
- Circuit
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Enhance best practices in SoC development by integrating the latest trends and innovations in logic technology. IDMs can leverage our coverage to gain critical insights that empower your teams to optimize and enhance designs. This ensures your SoCs continue to lead in innovation, performance, and user experience, setting benchmarks in the technology sector. Designed for pioneers aiming to redefine standards.
Offering
What's included
AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.
- Block Diagram
- Component Price and Lead-time Trends
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Performance Analysis
- Product Features
The AI coverage area focuses on the AI technology and how it impacts the semiconductor market. The forecasts include market size for various domains, including Data Centers, Cloud, PCs, Automotive, and mobile devices. It covers a range of hardware components, such as CPUs, GPUs, ASICs, and FPGAs. Additionally, the coverage offers both qualitative and quantitative insights into the latest trends in the AI market such as generative AI, LLMs, neural network evolution and so on.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Advanced CMOS Essentials focuses on leading-edge SoCs and the technology used to manufacture them through structural and materials analysis. It identifies differences or nuances between competing technologies and differences between process technology options from the same company. Process Analytics offers aggregated process data, helping you create visualizations and trends of company, product, and technology evolution.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
- Process
The compute coverage area delivers market share data and forecast analysis, encompassing cloud infrastructure, client computing, and embedded computing. The cloud computing segment includes microprocessors, accelerators, FPGAs and captive market ASICs. The client computing segment comprises CPUs, APUs, ASICs, and GPUs. The embedded computing segment includes MPUs, MCUs, FPGAs, DSPs, and GPUs. All these categories provide comprehensive coverage of AI processors and accelerators within their respective segments.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Data Center / Cloud Semiconductors
The Data Center / Cloud coverage area offers an integrated perspective on the essential components of global data centers for the upcoming five years, encompassing memory, storage solutions, CPUs, AI/GPU accelerators, and server infrastructure. This comprehensive analysis spans both private data centers and public cloud environments. It features a comparative evaluation of top public cloud providers, projecting service hours and hardware requisites. Additionally, the report includes an assessment of hardware market shares, highlighting dominant manufacturers in server, CPU, and accelerators.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.
- Competitor Analysis
- Data Visualisation
- IC Floorplan
- Inquiry Privileges
- Insight Reports
Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
- Block Diagram
- Component Price and Lead-time Trends
- Competitor Analysis
- EE Component Usage Across Products
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
- Packaging
- Performance Analysis
- Process
- Product Features
Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.
- Competitor Analysis
- Data Visualisation
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process Flow
Soc Design provides analysis of 4 sites in CPU, NPU, or GPU cores on high-volume, cutting-edge SoCs, addressing engineers’ challenges in gaining accurate benchmarking data on gate density, routing efficiency, and utilization. This expanded analysis also provides high-resolution imaging of SRAM and transition regions and can reveal critical redundancy strategies such as NVM rerouting, which help improve fault tolerance with repairable patterns. Engineers struggling to differentiate their designs can benefit from high-resolution images of custom cells and architectural choices like flying bitline design. Served through TechInsights’ CircuitVision and Analytics visualization tools, engineers are empowered to visualize and compare data across products and technologies, making it easier to identify the right optimization opportunities and enhance design efficiency. This solution reduces the time and complexity of competitive benchmarking while driving informed, fact-based design decisions.
- Circuit
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
- Product Features
Transistor Architecture Comparison
Transistor Architecture Comparison coverage provides insight into the front end of line (FEOL) innovation that drives the world's most advanced technology solutions and how industry leaders deployed them (TSMC, Samsung, Intel) over the last three generations.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
- Transistor Comparison
Transistor Characterization assists in seeing the complete picture of process technologies and DC performance (Transistor Characterization). Understand the process, see the benchmark, and spot the trends. Transistor Characterization and Process Analytics assists you in conducting trend and predictive analysis of process data and its impact on transistor characterization (DC) performance through customized visualizations.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
- Performance Analysis
Gain key insights to optimize your internal fab operations. IDMs can leverage our coverage to gain detailed insights into key wafer fabrication equipment and projections of fab capacity. These insights enable you to enhance your manufacturing processes, ensuring efficiency and maintaining a competitive edge in the market.
Offering
What's included
CMRS Equipment Database covers market shares with annual and quarterly forecasts for these segments along with equipment demand by device type and region.
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Market Data
Semiconductor Manufacturing Drivers
Semiconductor Manufacturing Drivers provide critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Market Data
CMRS More than Moore analysis focuses on equipment markets for greater than 28nm semiconductor manufacturing. Typical segments include LED, MEMs, power, and compound semiconductors.
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Market Data
CSUBs Critical Components includes market shares and forecast data for critical components as well as additional analysis for applications, consumption by equipment type or by OEMs and fabs.
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Market Data
Market share and forecast data for critical subsystem and components as well as equipment and chamber unit demand,
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Market Data
Essential data for assessing current market status, forecasting, and building dashboards.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Market Data
TST Device Interface Board Report
TST Device Interface Board Report provides market sizing and share databases, forecasts, regional and application sales for DIB providers.
- Block Diagram
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- High Resolution Images
- Inquiry Privileges
- Market Data
TST Probe Card Report provides market sizing and share databases, forecasts, and regional and application sales for providers.
- Block Diagram
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- High Resolution Images
- Inquiry Privileges
- Market Data
TST Test Burn-In Socket Report
TST Burn-In Socket Report provides market sizing and share databases, forecasts, regional and application sales for providers.
- Block Diagram
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- High Resolution Images
- Inquiry Privileges
- Market Data
Refine your memory procurement strategies with our comprehensive insights into DRAM and NAND markets. IDMs can optimize in-house production and make informed purchasing decisions by understanding cost efficiencies per bit. Our analysis spans market dynamics, including pricing and supply/demand shifts, alongside circuitry and material innovations. Equip your professionals to adapt to market fluctuations, ensuring strategic memory sourcing in a competitive landscape.
Offering
What's included
Advanced Memory Process analysis provides an overview of chip technology, critical features, and dimensions. It provides analyst insights into technical trends and roadmaps, design technology interaction analyses, detailed explanations of process integrations, and next node predictions.
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process
Highlights circuit innovation by providing full, transistor-level analysis on leading-edge DRAM memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.
- Block Diagram
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. DRAM Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.
- Competitor Analysis
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
NAND Peripheral Design focuses on the circuit schematic design of critical NAND device metrics for a better understanding of peripheral design, functionality, structure, and layout to help accelerate R&D and fast-track the design learning curve.
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
DRAM SWD and SA Transistor Characterization
Provides cross-technology and trend analysis as well as information on the performance of transistors used in DRAM through transistor characteristic analysis. Professionals from foundries, IDMs, and fabless organizations use this analysis to benchmark against competitors and to see how process differences impact performance between technologies.
- Block Diagram
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Performance Analysis
- Transistor Comparison
Embedded and Emerging Functional and Process Analysis
Embedded and Emerging Functional and Process Analysis is focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. It also provides analyst perspectives on the above to provide insight into trends and roadmaps. Analysis may include SEM cross-sectional and bevel imaging, TEM cross-sectional with TEM EDS, technical trend/roadmap by technology element, interaction analysis, detailed explanation of process integrations and/or next node predictions.
- Competitor Analysis
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
- Process
Embedded and Emerging Process Flow
Embedded and Emerging Process Flow provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips to help identify areas for process optimization.
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process Flow
The Memory coverage area provides a comprehensive analysis of the NAND and DRAM markets, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive (DRAM) and SSDs, eMMC and UFS (NAND). It meticulously maps the market landscape, offering insights into production volumes, pricing trends, technological advancements, and market shares. The report highlights the factors influencing memory supply, such as manufacturing capacities and capacity utilization, and delves into demand fluctuations driven by consumer electronics cycles, enterprise IT investments, AI and automotive industry requirements.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Highlights circuit innovation by providing full, transistor-level analysis on leading-edge NAND memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.
- Block Diagram
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
NAND Internal Waveform Overview
NAND Internal Waveform Analysis captures the specific steps, pulses, and amplitudes on select pins during program, read, and erase cycles of one flash die of a package. The content provides an innovative, cost-effective approach to delivering a subset of a waveform analysis report.
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Systems
In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.
- Competitor Analysis
- High Resolution Images
- IC Floorplan
- Inquiry Privileges
- Insight Reports
NAND Transistor Characterization
NAND Transistor Characterization provides cross-technology analysis and information on the performance of transistors used in NAND devices through transistor characteristic analysis. It provides key information on competition and vendor performance with unbiased third party data.
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Performance Analysis
- Transistor Comparison
Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.
- Competitor Analysis
- Data Visualisation
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process Flow
SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
IDMs can navigate the complexities of RF design across 5G and legacy networks with our comprehensive analyses from antenna to transceiver, covering a wide range of technologies including crucial mmWave systems. Leverage our state-of-the-art lab technologies and expert insights to integrate these advancements into your product roadmap. Equip your team with in-depth insights into component integration, energy efficiency, and signal optimization strategies, maintaining a competitive edge with innovative and cost-effective RF solutions.
Offering
What's included
Provides more insight into filter design strategies and their integration in RF front end (RFFE) SiPs to support evolving 5G demands and requirements. This content includes structural, materials, and topographical analyses of acoustic filters from highly integrated 5G RF Front End Modules and System-in-Packages (SiPs).
- Block Diagram
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Process
Reveals how leading manufacturers are addressing space and power challenges in RF power amplifiers (PAs), low noise amplifiers (LNAs) and RF switches found on current RF Front End Modules. Extends the analysis from the Front End Module Architecture content to reveal more detailed insight at the circuit level.
- Block Diagram
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
- Product Features
Provides more insight on how leading manufacturers are shifting away from discrete components to more space efficient solutions like power amplifier modules (PAM) and transceiver antenna modules. Shows interconnectivity of the die, filters and components from highly integrated RF Front End Modules (FEMs) found on cutting-edge designs from the latest 5G handsets.
- Block Diagram
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
Front End Power Management Architecture
Enables a better comparison and understanding of how design constraints for power supply management are addressed. Includes and builds on the Front End Power Management Floorplan content to provide detailed block level architecture of envelope/average power trackers and FR2 PMICs.
- Circuit
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
Front End Power Management Floorplan
Focuses on power supply management, which is a key design challenge for RF Front End systems within market leading 5G handsets. Provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for envelope/average power trackers and FR2 PMICs from recent 5G smartphone platforms and wearables.
- Block Diagram
- Circuit
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Insight Reports
With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.
- Block Diagram
- Competitor Analysis
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design. There is no black boxing, and the reports include all passives in the system, antenna tuners, filters, FEM high-level layout, pin ins/pin outs, circuit board delayering, and cross-probing between the schematic and the layout of the physical printed circuit board (PCB).
- Block Diagram
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
The Mobile coverage area provides a comprehensive analysis of semiconductor consumption by leading mobile device manufacturers. It integrates this data with market share insights from key players in the application processor and baseband semiconductor landscape. The analysis is further enriched with detailed coverage of AI-capable application processors, as well as Apple’s A-series and M-series chips.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.
- Block Diagram
- High Resolution Images
- Packaging
RFIC Process provides structural and materials analysis of transceivers and front end modules from the latest 5G handsets to reveal die structures and materials used during the manufacturing process. It includes topographical imaging and SEM/TEM cross-sectional with EDS/EELS materials analysis of the die structure.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Process
Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.
- Circuit
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
Transceiver Basic Floorplan targets the most innovative IoT SoC devices to provide key information on die utilization, block sizes and functionality, die cost and more, to better understand the core functions of the SoC chip.
- Competitor Analysis
- IC Floorplan
- Inquiry Privileges
- Insight Reports
Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
IDMs can gain essential insights into GaN, SiC, and Si technologies to navigate complex market dynamics and understand competitor strategies. Leverage our detailed analyses of device structures and materials to enhance your efficiency and reduce costs. Our coverage provides the competitive intelligence needed to lead in power technology. Align your product strategy with the latest industry advancements for a definitive competitive edge.
Offering
What's included
PMIC Process Analysis provides in-depth process (structural and materials) analysis of power-management devices based on bipolar-CMOS-DMOS (BCD) technology, integrated voltage regulators (IVR), and other innovative power management devices. It includes analysis of PMICs found in devices in the mobile, automotive, and other industries, and covers structures and materials using SEM, TEM, sMIM/SCM, SEM-EDS, and TEM-EDS/EELS as required. It also includes package and die images and salient features with a comparison summary.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Process
Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Inquiry Privileges
- Insight Reports
- Process
The Power coverage area includes the market share of leading vendors, along with market forecasts segmented by technology (GaN, Si, SiC), device type, end-market application, and region. The device types considered in this coverage include power ICs, power discretes, and power modules.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow
Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.
- Block Diagram
- Competitor Analysis
- High Resolution Images
- Inquiry Privileges
- Process Flow
IDMs can learn what innovations are in demand and will soon be within the smartphones, tablets, and wearables landscape. Using our reports and analysis, design semiconductors with advanced process technologies, power efficiency, security enhancements, the integration of AI, and more to meet the needs of your end customers. Leverage our insights to stay ahead in the competitive market and ensure your products are at the forefront of technological advancements.
Offering
What's included
Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Emerging Device Technologies delivers fast-moving shipment tracking and sales forecasting of the key technologies powering modern smartphones and emerging classes of new devices. EDT identifies the key technologies powering smartphones right now and which will emerge in the future, such as artificial intelligence or 5G mmWave. Technology is the lens used to track device shipments and sales for individual vendors across the globe down to the country level.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
The Mobile coverage area provides a comprehensive analysis of semiconductor consumption by leading mobile device manufacturers. It integrates this data with market share insights from key players in the application processor and baseband semiconductor landscape. The analysis is further enriched with detailed coverage of AI-capable application processors, as well as Apple’s A-series and M-series chips.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Notebooks and Tablets Teardown
Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
PriceTRAX Web for smartphones, tablets, feature phones, and wearables tracks competitor pricing strategies, country-specific and regional dynamics, price erosion, and more. View the retail value between variants of the same model to determine technology pricing trends and see current competitor retail prices with a full history dating back to 2010. Designed for responsiveness, PriceTRAX Smartphone dashboards include bundle pricing analytics, device-only prices, and spec/price analytics.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Market Data
Smartphone Country Share Tracker
Smartphone Country Share Tracker gives you timely, super-detailed tracking of smartphone brand shipments and market share by country, operator, and global best-selling models.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Insight Reports
- Market Data
SpecTRAX tracks new model announcements and complete hardware specification profiles for over 50,000 smartphones, tablets, feature phones, and wearables. It breaks down products into more than 350 standardized attributes for data that is exportable and ready to analyze. You’ll also get access to product availability from mobile operators and retailers, tracked across over 50 countries.
- Competitor Analysis
- Data Visualisation
- Inquiry Privileges
- Market Data
- Supply Analysis
Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Wearable Device Ecosystem gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. It also delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share, and price.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.
- Block Diagram
- Cost Analysis
- High Resolution Images
- Inquiry Privileges
- Product Features
Wireless Smartphone Strategies
Wireless Smartphone Strategies provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier, and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarters and country-level smartphone forecast data for the next 5 years are provided.
- Competitor Analysis
- Data Visualisation
- Demand Forecasts
- Inquiry Privileges
- Insight Reports
- Market Data
- Supply Analysis
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To set the bar for semiconductor sustainability and provide analysis and leadership to address the industry's carbon footprint, TechInsights has developed the Global Semiconductor Carbon Emissions Forecast, 2025-2030.
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