Kunpeng 920 Huawei SROCV120 And ROCV135CS Advanced Packaging Quick Look Analysis
Discover Huawei's Kunpeng 920 chiplet architecture and its impact on advanced packaging. Ideal for designers, suppliers, and packaging experts.
Huawei has a long history of ARM-based processor development. The Kunpeng 920 family launched in 2019 as 7 nm devices aimed at datacenter processing workloads, leveraging chiplet design allowing easy manufacture of scaled devices. In this report we provide technical analysis of the Kunpeng 920 package variants marked SROCV120 and ROCV135CS. The two packages were manufactured in different countries using different technologies, but both leverage the same silicon chiplets, demonstrating the operational advantages of a chiplet architecture. The report will be of interest to device and package designers, equipment and materials suppliers, and all of those connected to the advanced packaging supply chain.
