Intel Core Ultra 7 258 (Lunar Lake) Advanced Packaging Quick Look Analysis
Discover Intel's Lunar Lake advancements in chiplet design and Foveros packaging. Explore co-packaged memory, metallization differences, and new features in our detailed structural and material analysis.
Intel Lunar Lake follows Meteor Lake as a consumer laptop processor leveraging chiplet design and Foveros advanced packaging technology. However, with the Intel Core Ultra 7 258 the broader packaging strategy has evolved beyond Meteor Lake to include co-packaged memory components beside the processor, similar to the strategy Apple employs in their M-series devices. Additionally, in Lunar Lake we observe refinements in Foveros packaging capabilities and differences in the metallization of the TSMC supplied chiplets, as well as other new packaging features. In this report we provide detailed structural and material analysis of the complete packaging structure.
