Hybrid Bonding –Tomorrow’s Interconnect

A Detailed Look at Hybrid Bonding’s Role in Advanced Semiconductor Packaging

Hybrid Bonding –Tomorrow’s Interconnect

Don’t Miss Out – Watch Anytime!

Gain data-driven insights into hybrid bonding’s impact on semiconductor packaging.

Enter your information below to view the webinar for FREE on the TechInsights Platform.

Already have a subscription?

View the Webinar Today!

Hybrid bonding is advancing semiconductor packaging by enabling high-density 3D copper-to-copper connections to improve performance in near-memory computing, and high-performance computing (HPC). While already proven in image sensors, its adoption is expanding across the industry.

In this webinar, TechInsights experts examine:

  • The evolution of hybrid bonding and its role in interconnect scaling.
  • Examples from our technical analyses, covering image sensors, NAND, HBM, near memory computing and 3D integration.
  • The market landscape, market drivers and ecosystem supporting hybrid bonding adoption.

Who Should Watch?

This session is a must for professionals in engineering, product development, marketing, and strategy who are evaluating interconnect scaling technologies and looking to stay ahead in semiconductor innovation.

 

TechInsights

 
LinkedIn
X
YouTube
App Store
Google Play Store
 
 
EcoVadis
ISO 27001 Certified