Hybrid Bonding –Tomorrow’s Interconnect
A Detailed Look at Hybrid Bonding’s Role in Advanced Semiconductor Packaging
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Gain data-driven insights into hybrid bonding’s impact on semiconductor packaging.
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Hybrid bonding is advancing semiconductor packaging by enabling high-density 3D copper-to-copper connections to improve performance in near-memory computing, and high-performance computing (HPC). While already proven in image sensors, its adoption is expanding across the industry.
In this webinar, TechInsights experts examine:
- The evolution of hybrid bonding and its role in interconnect scaling.
- Examples from our technical analyses, covering image sensors, NAND, HBM, near memory computing and 3D integration.
- The market landscape, market drivers and ecosystem supporting hybrid bonding adoption.
Who Should Watch?
This session is a must for professionals in engineering, product development, marketing, and strategy who are evaluating interconnect scaling technologies and looking to stay ahead in semiconductor innovation.
